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0. The ornamental design for a headphone, as shown and described.
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FIG. 1 is a perspective view of a headphone showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken line showing in the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 21 2004 | Sony Corporation | (assignment on the face of the patent) |
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