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The ornamental design for an electrical test probe probing head, as shown and described. |
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FIG. 1 is a perspective view of an electrical test probe probing head with the probing head angled slightly away from the viewer showing the new design, wherein the broken line depictions of the cable and tip are included merely for illustrative purposes and form no part of the claimed design.
FIG. 2 is a perspective view of an electrical test probe probing head with the probing head angled slightly towards the viewer showing the new design, wherein the broken line depictions of the cable and tip are included merely for illustrative purposes and form no part of the claimed design.
FIG. 3 is a left side view of the electrical test probe probing head, the left right view being a mirror image thereof, wherein the broken line depictions of the cable and tip are included merely for illustrative purposes and forms no part of the claimed design.
FIG. 4 is a top view of the electrical test probe probing head, wherein the broken line depictions of the cable and tip are included merely for illustrative purposes and forms no part of the claimed design.
FIG. 5 is a front view of the electrical test probe probing head, wherein the broken line depictions of the cable and tip are included merely for illustrative purposes and forms no part of the claimed design,
FIG. 6 is a back view of the electrical test probe probing head, wherein the broken line depictions of the cable and tip are included merely for illustrative purposes and forms no part of the claimed design; and,
FIG. 7 is a bottom view of the electrical test probe probing head, wherein the broken line depictions of the cable and tip are included merely for illustrative purposes and forms no part of the claimed design.
| Patent | Priority | Assignee | Title |
| 10119992, | Apr 01 2015 | Tektronix, Inc | High impedance compliant probe tip |
| 9810715, | Dec 31 2014 | Tektronix, Inc | High impedance compliant probe tip |
| D474415, | Jul 16 2002 | Snap-on Technologies, Inc. | Test lead head |
| D983681, | Dec 03 2020 | MPI Corporation | Probe for testing device under test |
| Patent | Priority | Assignee | Title |
| D354923, | Jan 31 1994 | Tektronix, Inc.; Tektronix, Inc | Probing head for an electrical test probe |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jul 31 2000 | LeCroy Corporation | (assignment on the face of the patent) | / | |||
| Aug 22 2000 | CAMPBELL, JULIE A | LeCroy Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011166 | /0666 | |
| Sep 30 2003 | LeCroy Corporation | LeCroy Corporation | CHANGE OF ADDRESS | 014015 | /0787 | |
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| Aug 03 2012 | LeCroy Corporation | TELEDYNE LECROY, INC | MERGER SEE DOCUMENT FOR DETAILS | 029162 | /0724 | |
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| Oct 09 2012 | MANUFACTURERS AND TRADERS TRUST COMPANY, AS AGENT | LeCroy Corporation | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 029128 | /0280 | |
| Oct 18 2012 | JP MORGAN CHASE BANK, N A AS ADMINISTRATIVE AGENT SUCCESSOR ADMINISTRATIVE AGENT TO THE BANK OF NEW YORK | LeCroy Corporation | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 029328 | /0042 |
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