Patent
   D446525
Priority
Aug 24 1999
Filed
Feb 23 2000
Issued
Aug 14 2001
Expiry
Aug 14 2015
Assg.orig
Entity
unknown
219
22
n/a
The ornamental design for IC memory card, as shown and described.

FIG. 1 is a top, front and right side perspective view of IC memory card showing our new design,

FIG. 2 is a front elevational view thereof,

FIG. 3 is a right side elevational view thereof,

FIG. 4 is a left side elevational view thereof,

FIG. 5 is a top plan view thereof,

FIG. 6 is a bottom plan view thereof,

FIG. 7 is a rear elevational view thereof; and,

FIG. 8 is a top, rear and right side perspective view thereof.

Okamoto, Kosei, Pinto, Yosi, Torii, Takashi, Cedar, Yoram, Wallace, Bob, Auclair, Dan

Patent Priority Assignee Title
10034372, Jun 12 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable via package and method
10192816, Aug 11 2015 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package and fabricating method thereof
10206285, Jun 12 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable via package and method
10257942, Aug 06 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable variable height via package and method
10347562, Feb 18 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Methods and structures for increasing the allowable die size in TMV packages
10461006, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Encapsulated semiconductor package
10490716, Sep 06 2016 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device with optically-transmissive layer and manufacturing method thereof
10548221, Jun 12 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable via package and method
10679952, Nov 20 2012 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof
10784422, Sep 06 2016 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device with optically-transmissive layer and manufacturing method thereof
10811277, Aug 01 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Encapsulated semiconductor package
10903181, Nov 04 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Wafer level fan out semiconductor device and manufacturing method thereof
10943858, Aug 11 2015 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package and fabricating method thereof
11081370, Mar 23 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Methods of manufacturing an encapsulated semiconductor device
11089685, Jun 12 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. Stackable via package and method
11094560, Mar 23 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Encapsulated semiconductor package
11437552, Sep 06 2016 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. Semiconductor device with transmissive layer and manufacturing method thereof
11488892, Feb 18 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. Methods and structures for increasing the allowable die size in TMV packages
11527496, Nov 20 2012 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof
11652038, Aug 11 2015 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. Semiconductor package with front side and back side redistribution structures and fabricating method thereof
11700692, Jun 12 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. Stackable via package and method
11848214, Aug 01 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. Encapsulated semiconductor package
11855023, Nov 04 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. Wafer level fan out semiconductor device and manufacturing method thereof
6570825, Aug 21 2001 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Method and circuit module package for automated switch actuator insertion
6632997, Jun 13 2001 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Personalized circuit module package and method for packaging circuit modules
6646885, Oct 03 2002 C-One Technology Corp.; Pretec Electronics Corp. Enhanced electronic card structure
6717822, Sep 20 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Lead-frame method and circuit module assembly including edge stiffener
6762930, Jan 17 2002 HEWLETT-PACKARD DEVELOPMENT COMPANY L P Form factor card with status indicator
6816032, Sep 03 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Laminated low-profile dual filter module for telecommunications devices and method therefor
6900527, Sep 19 2001 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Lead-frame method and assembly for interconnecting circuits within a circuit module
6910635, Oct 08 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Die down multi-media card and method of making same
6911718, Jul 03 2003 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Double downset double dambar suspended leadframe
6967124, Jun 19 2001 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
7011251, Oct 08 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Die down multi-media card and method of making same
7019387, Feb 14 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Lead-frame connector and circuit module assembly
7074654, Apr 21 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Tape supported memory card leadframe structure
7092256, Apr 26 2002 SanDisk Technologies LLC Retractable card adapter
7102214, Dec 26 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Pre-molded leadframe
7102891, Jul 23 2003 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
7112875, Feb 17 2005 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Secure digital memory card using land grid array structure
7145238, May 05 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package and substrate having multi-level vias
7152801, Apr 16 2004 SanDisk Technologies LLC Memory cards having two standard sets of contacts
7185426, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Method of manufacturing a semiconductor package
7193305, Nov 03 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Memory card ESC substrate insert
7201327, Oct 18 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Memory card and its manufacturing method
7220915, Feb 17 2005 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Memory card and its manufacturing method
7293716, Feb 17 2005 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Secure digital memory card using land grid array structure
7297562, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
7306160, Jul 17 2003 SanDisk Technologies LLC Memory card with adapter
7306161, Jul 17 2003 SanDisk Technologies LLC Memory card with chamfer
7307848, Jul 17 2003 SanDisk Technologies LLC Memory card with raised portion
7310692, Apr 16 2004 SanDisk Technologies LLC Memory card with integral covered second device connector for use with computing devices without a memory card slot
7312103, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Method for making an integrated circuit substrate having laser-embedded conductive patterns
7334326, Jun 19 2001 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Method for making an integrated circuit substrate having embedded passive components
7336498, Jul 17 2003 SanDisk Technologies LLC Memory card with push-push connector
7340540, Apr 16 2004 SanDisk Technologies LLC Memory card with contacts, device connector, and a connector covering mechanism
7355860, Apr 16 2004 SanDisk Technologies LLC Memory card with two standard sets of contacts and a contact covering mechanism
7358600, May 01 2003 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Interposer for interconnecting components in a memory card
7359204, Feb 15 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Multiple cover memory card
7364090, Apr 16 2004 SanDisk Technologies LLC Memory cards having two standard sets of contacts
7365006, May 05 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package and substrate having multi-level vias fabrication method
7375975, Oct 31 2005 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Enhanced durability memory card
7399661, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Method for making an integrated circuit substrate having embedded back-side access conductors and vias
7416132, Jul 17 2003 SanDisk Technologies LLC Memory card with and without enclosure
7485491, Feb 17 2005 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Secure digital memory card using land grid array structure
7487265, Apr 16 2004 SanDisk Technologies LLC Memory card with two standard sets of contacts and a hinged contact covering mechanism
7492601, Apr 26 2002 SanDisk Technologies LLC Retractable card adapter
7501338, Jun 19 2001 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package substrate fabrication method
7548430, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Buildup dielectric and metallization process and semiconductor package
7550857, Nov 16 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stacked redistribution layer (RDL) die assembly package
7554813, Apr 16 2004 SanDisk Technologies LLC Memory card with two standard sets of contacts and a contact covering mechanism
7556986, Apr 21 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Tape supported memory card leadframe structure
7589398, Oct 04 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Embedded metal features structure
7633763, Jan 28 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Double mold memory card and its manufacturing method
7633765, Mar 23 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package including a top-surface metal layer for implementing circuit features
7670962, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Substrate having stiffener fabrication method
7671457, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package including top-surface terminals for mounting another semiconductor package
7710736, Aug 02 2005 SanDisk Technologies LLC Memory card with latching mechanism for hinged cover
7719845, Apr 26 2005 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Chamfered memory card module and method of making same
7750250, Dec 22 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Blind via capture pad structure
7752752, Jan 09 2007 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Method of fabricating an embedded circuit pattern
7787243, Apr 26 2002 SanDisk Technologies LLC Retractable card adapter
7822883, Apr 16 2004 SanDisk Technologies LLC Memory card with two standard sets of contacts and a hinged contact covering mechanism
7825520, Nov 16 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stacked redistribution layer (RDL) die assembly package
7837120, Nov 29 2005 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Modular memory card and method of making same
7864540, Jul 17 2003 SanDisk Technologies LLC Peripheral card with sloped edges
7911037, Oct 04 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Method and structure for creating embedded metal features
7960827, Apr 09 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Thermal via heat spreader package and method
8018068, Mar 23 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package including a top-surface metal layer for implementing circuit features
8026587, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package including top-surface terminals for mounting another semiconductor package
8110909, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package including top-surface terminals for mounting another semiconductor package
8203203, Nov 16 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stacked redistribution layer (RDL) die assembly package
8222538, Jun 12 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable via package and method
8227338, Mar 23 2004 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package including a top-surface metal layer for implementing circuit features
8294276, May 27 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device and fabricating method thereof
8300423, May 25 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable treated via package and method
8316536, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Multi-level circuit substrate fabrication method
8322030, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
8323771, Aug 15 2007 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Straight conductor blind via capture pad structure and fabrication method
8337657, Oct 27 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Mechanical tape separation package and method
8338229, Jul 30 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable plasma cleaned via package and method
8341835, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Buildup dielectric layer having metallization pattern semiconductor package fabrication method
8471154, Aug 06 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable variable height via package and method
8482134, Nov 01 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable package and method
8525318, Nov 10 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device and fabricating method thereof
8535961, Dec 09 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Light emitting diode (LED) package and method
8536462, Jan 22 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Flex circuit package and method
8557629, Dec 03 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device having overlapped via apertures
8623753, May 28 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable protruding via package and method
8629546, Nov 16 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stacked redistribution layer (RDL) die assembly package
8633598, Sep 20 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Underfill contacting stacking balls package fabrication method and structure
8653674, Sep 15 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Electronic component package fabrication method and structure
8671565, Dec 22 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Blind via capture pad structure fabrication method
8690283, Oct 20 2009 Western Digital Israel Ltd Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device
8704368, Jun 12 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable via package and method
8717775, Aug 02 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Fingerprint sensor package and method
8753730, Oct 27 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Mechanical tape separation package
8796561, Oct 05 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Fan out build up substrate stackable package and method
8826531, Apr 05 2005 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
8872329, Jan 09 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Extended landing pad substrate package structure and method
8890329, Apr 26 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device
8890337, Sep 20 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Column and stacking balls package fabrication method and structure
8937381, Dec 03 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Thin stackable package and method
8941250, Sep 15 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Electronic component package fabrication method and structure
9012789, Jun 12 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable via package and method
9013011, Mar 11 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stacked and staggered die MEMS package and method
9029962, Oct 12 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Molded cavity substrate MEMS package fabrication method and structure
9177932, Dec 03 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device having overlapped via apertures
9391043, Nov 20 2012 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device and manufacturing method thereof
9462704, Jan 09 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Extended landing pad substrate package structure and method
9496210, Nov 01 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable package and method
9543242, Aug 11 2015 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package and fabricating method thereof
9691635, May 01 2002 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Buildup dielectric layer having metallization pattern semiconductor package fabrication method
9691734, Dec 07 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Method of forming a plurality of electronic component packages
9704747, Mar 29 2013 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device and manufacturing method thereof
9704842, Nov 04 2013 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package
9721872, Feb 18 2011 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Methods and structures for increasing the allowable die size in TMV packages
9728514, Nov 20 2012 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device and manufacturing method thereof
9730327, Jun 12 2009 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Stackable via package and method
9748154, Nov 04 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Wafer level fan out semiconductor device and manufacturing method thereof
9812386, Aug 01 2006 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Encapsulated semiconductor package
9837331, Dec 03 2010 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device having overlapped via apertures
9852976, Aug 11 2015 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package and fabricating method thereof
9960328, Sep 06 2016 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor device and manufacturing method thereof
D457887, Sep 28 2001 Sony Corporation Recording medium
D458935, Feb 16 2001 Kabushiki Kaisha Toshiba Communications card
D459355, Mar 16 2001 SD-3C, LLC IC memory card
D460456, Mar 16 2001 SD-3C, LLC IC memory card
D466872, Jul 05 2001 Sony Corporation Cartridge
D467586, Mar 16 2001 SD-3C, LLC IC memory card
D474774, Feb 20 2002 Olympus Corporation IC card
D475055, Feb 20 2002 Olympus Corporation Portion of an IC card
D475056, Feb 20 2002 Olympus Corporation IC card
D475711, Feb 20 2002 Olympus Corporation Portion of an IC card
D475712, Feb 20 2002 Olympus Corporation Portion of an IC card
D475713, Feb 20 2002 Olympus Corporation IC card
D475714, Feb 20 2002 Olympus Corporation Portion of an IC card
D476011, Feb 20 2002 Olympus Corporation IC card
D476012, Feb 20 2002 Olympus Corporation IC card
D479845, Feb 20 2002 Olympus Corporation IC card
D488475, Dec 13 2002 C-One Technology Corp.; Pretec Electronics Corp. Removable electronic card
D488476, Dec 13 2002 C-One Technology Corp.; Pretec Electronics Corp. Removable dual-head electronic card
D488477, Dec 13 2002 C-One Technology Corp.; Pretec Electronics Corp. Removable electronic card
D491951, Dec 13 2002 C-One Technology Corp.; Pretec Electronics Corp. Removable electronic card
D492686, Dec 13 2002 C-One Technology Corp.; Pretec Electronics Corp. Removable dual-head electronic card
D492687, Dec 13 2002 C-One Technology Corp.; Pretec Electronics Corp. Removable electronic card
D492688, Dec 09 2002 SanDisk Technologies LLC Memory card
D493466, Oct 13 2003 C-One Technology Corporation Memory card
D494180, May 07 2003 SD-3C, LLC IC card
D498760, Dec 30 2003 Siliconware Precision Industries Co., Ltd. Digital memory card
D499100, Jun 10 2003 TRIVIDIA HEALTH, INC Removable memory module for a meter
D505959, Oct 15 2002 SD-3C, LLC IC memory card
D507795, Oct 15 2002 SD-3C, LLC IC memory card
D510579, Jan 15 2002 SD-3C, LLC IC memory card
D510935, Oct 15 2002 SD-3C, LLC IC memory card
D515586, Apr 16 2004 SanDisk Technologies LLC Memory card with two sets of contacts
D515587, Apr 16 2004 SanDisk Technologies LLC Memory card with two sets of contacts
D517072, Oct 15 2002 SD-3C, LLC IC memory card
D518059, Apr 16 2004 SanDisk Technologies LLC Memory card with two sets of contacts
D523435, Jul 17 2003 SD-3C, LLC Memory card
D525248, Jul 17 2003 SD-3C, LLC Memory card
D525623, Jul 17 2003 SD-3C, LLC Memory card
D525978, Jul 17 2003 SD-3C, LLC Memory card
D531181, Apr 16 2004 SanDisk Technologies LLC Combined memory card and carrier assembly
D532788, Apr 16 2004 SanDisk Technologies LLC Combined memory card and carrier assembly
D533556, Oct 15 2002 SD-3C, LLC IC memory card
D535297, Apr 16 2004 SanDisk Technologies LLC Memory card with two sets of contacts
D536382, Apr 07 2004 NINTENDO CO , LTD Information storage cartridge for electronic game machine
D537081, Jul 17 2003 SD-3C, LLC Memory card
D537824, May 19 2005 SanDisk Technologies LLC Flash memory card with translucent cover
D538286, Jul 17 2003 SD-3C, LLC Memory card
D542797, Aug 02 2005 SanDisk Technologies LLC Memory card with a contact covering lid
D552098, May 24 2005 Renesas Electronics Corporation Memory card
D552099, May 24 2005 Renesas Electronics Corporation Memory card
D552612, May 24 2005 Renesas Electronics Corporation Memory card
D554123, May 19 2005 SanDisk Technologies LLC Flash memory card with a translucent cover
D556764, May 24 2005 Renesas Electronics Corporation Memory card
D579940, Mar 15 2007 PULSE DATA INVESTMENTS INC INVESTISSEMENTS PULSE DATA INC ; TECHNOLOGIES HUMANWARE INC Cartridge
D581932, May 24 2005 Renesas Electronics Corporation Memory card
D585068, Nov 09 2007 Vizio, Inc Memory card with contact exposing openings
D588133, Dec 17 2007 Panasonic Corporation IC memory card
D588134, Jan 11 2008 Panasonic Corporation IC memory card
D588135, Apr 01 2008 Panasonic Corporation IC memory card
D588597, Dec 17 2007 Panasonic Corporation IC memory card
D588598, Apr 01 2008 Panasonic Corporation IC memory card
D588599, Apr 01 2008 Panasonic Corporation IC memory card
D628202, Oct 20 2009 SanDisk Technologies LLC MicroSD memory card with different color surfaces
D638431, Oct 20 2009 SanDisk Technologies LLC MicroSD memory card with a semi-transparent color surface
D639302, May 17 2010 Panasonic Corporation Memory card
D639812, May 17 2010 Panasonic Corporation Memory card
D643040, Oct 26 2010 Hon Hai Precision Ind. Co., Ltd. Electrical card
D643431, May 17 2010 Panasonic Corporation Memory card
D643432, May 17 2010 Panasonic Corporation Memory card
D667830, Nov 29 2011 Samsung Electronics Co., Ltd. SD memory card
D670292, May 17 2011 Sony Computer Entertainment Inc Recording medium
D700183, Aug 30 2012 Nifty Drives Ltd Computer accessory
D704192, Aug 30 2012 Nifty Drives Ltd Computer accessory
D726189, Apr 03 2014 Transcend Information, Inc. Secure digital card
RE47112, Oct 20 2009 Western Digital Israel Ltd Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device
Patent Priority Assignee Title
6097605, Nov 25 1995 Stocko Metallwaren Fabriken Henkels und Sohn GmbH & Co. Contacting unit for card-shaped support elements for electronic components
6108209, Jul 24 1995 GLOBALFOUNDRIES Inc Snap together PCMCIA cards with laser tack welded seams
D267714, Feb 01 1980 Victor Company of Japan, Limited Pre-recorded cartridge video/audio disk
D311391, Sep 08 1987 Kabushiki Kaisha Toshiba Data recording cartridge for language learning machine
D368082, May 07 1994 Sony Computer Entertainment Inc Memory card
D369156, Sep 20 1994 Kabushiki Kaisha Toshiba IC Card
D369157, Mar 16 1995 Kabushiki Kaisha Toshiba IC card
D371548, Nov 30 1993 Kabushiki Kaisha Toshiba Optical disk cartridge
D374436, Nov 30 1993 Kabushiki Kaisha Toshiba Optical disk cartridge
D375941, Dec 08 1992 International Business Machines Corp Top, front, rear, left and right sides of an enlarged jacketed circuit card
D377344, Nov 30 1993 Kabushiki Kaisha Toshiba Optical disk cartridge
D405441, Sep 04 1997 CITIZEN HOLDINGS CO , LTD IC card
D407392, Jun 23 1997 Infineon Technologies AG Chipcard
D410913, Oct 13 1997 CITIZEN HOLDINGS CO , LTD LC card
D415132, Apr 08 1998 Honda Tsushin Kogyo Co., Ltd. Memory card
D416886, Dec 24 1998 Honda Tsushin Kogyo Co., Ltd. Compact flash card
D417212, Aug 06 1997 Sony Corporation Case for semiconductor element
JP1038035,
JP923611,
JP953684,
JP9536841,
XHM40547,
////////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 23 2000Kabushiki Kaisha Toshiba(assignment on the face of the patent)
Feb 23 2000Matsushita Electric Industrial Co.(assignment on the face of the patent)
Feb 23 2000SanDisk Corporation(assignment on the face of the patent)
Sep 25 2000OKAMOTO, KOSEIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0114070495 pdf
Oct 13 2000TORRI, TAKASHIMatsushita Electric Industrial CoASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0114070482 pdf
Nov 12 2000PINTO, YOSHISanDisk CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0114070979 pdf
Nov 13 2000WALLACE, BOBSanDisk CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0114070979 pdf
Nov 13 2000CEDAR, YORAMSanDisk CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0114070979 pdf
Nov 15 2000AUCLAIR, DANSanDisk CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0114070979 pdf
Oct 10 2007MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD SD-3C, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0206270098 pdf
Oct 23 2007Toshiba CorporationSD-3C, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0206270098 pdf
Oct 26 2007SanDisk CorporationSD-3C, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0206270098 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule