|
The ornamental design for IC memory card, as shown and described. |
FIG. 1 is a top, front and right side perspective view of IC memory card showing our new design,
FIG. 2 is a front elevational view thereof,
FIG. 3 is a right side elevational view thereof,
FIG. 4 is a left side elevational view thereof,
FIG. 5 is a top plan view thereof,
FIG. 6 is a bottom plan view thereof,
FIG. 7 is a rear elevational view thereof; and,
FIG. 8 is a top, rear and right side perspective view thereof.
Okamoto, Kosei, Pinto, Yosi, Torii, Takashi, Cedar, Yoram, Wallace, Bob, Auclair, Dan
Patent | Priority | Assignee | Title |
10034372, | Jun 12 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable via package and method |
10192816, | Aug 11 2015 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package and fabricating method thereof |
10206285, | Jun 12 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable via package and method |
10257942, | Aug 06 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable variable height via package and method |
10347562, | Feb 18 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Methods and structures for increasing the allowable die size in TMV packages |
10461006, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Encapsulated semiconductor package |
10490716, | Sep 06 2016 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device with optically-transmissive layer and manufacturing method thereof |
10548221, | Jun 12 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable via package and method |
10679952, | Nov 20 2012 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof |
10784422, | Sep 06 2016 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device with optically-transmissive layer and manufacturing method thereof |
10811277, | Aug 01 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Encapsulated semiconductor package |
10903181, | Nov 04 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Wafer level fan out semiconductor device and manufacturing method thereof |
10943858, | Aug 11 2015 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package and fabricating method thereof |
11081370, | Mar 23 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Methods of manufacturing an encapsulated semiconductor device |
11089685, | Jun 12 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. | Stackable via package and method |
11094560, | Mar 23 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Encapsulated semiconductor package |
11437552, | Sep 06 2016 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. | Semiconductor device with transmissive layer and manufacturing method thereof |
11488892, | Feb 18 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. | Methods and structures for increasing the allowable die size in TMV packages |
11527496, | Nov 20 2012 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. | Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof |
11652038, | Aug 11 2015 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. | Semiconductor package with front side and back side redistribution structures and fabricating method thereof |
11700692, | Jun 12 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. | Stackable via package and method |
11848214, | Aug 01 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. | Encapsulated semiconductor package |
11855023, | Nov 04 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. | Wafer level fan out semiconductor device and manufacturing method thereof |
6570825, | Aug 21 2001 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Method and circuit module package for automated switch actuator insertion |
6632997, | Jun 13 2001 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Personalized circuit module package and method for packaging circuit modules |
6646885, | Oct 03 2002 | C-One Technology Corp.; Pretec Electronics Corp. | Enhanced electronic card structure |
6717822, | Sep 20 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Lead-frame method and circuit module assembly including edge stiffener |
6762930, | Jan 17 2002 | HEWLETT-PACKARD DEVELOPMENT COMPANY L P | Form factor card with status indicator |
6816032, | Sep 03 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Laminated low-profile dual filter module for telecommunications devices and method therefor |
6900527, | Sep 19 2001 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Lead-frame method and assembly for interconnecting circuits within a circuit module |
6910635, | Oct 08 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Die down multi-media card and method of making same |
6911718, | Jul 03 2003 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Double downset double dambar suspended leadframe |
6967124, | Jun 19 2001 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate |
7011251, | Oct 08 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Die down multi-media card and method of making same |
7019387, | Feb 14 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Lead-frame connector and circuit module assembly |
7074654, | Apr 21 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Tape supported memory card leadframe structure |
7092256, | Apr 26 2002 | SanDisk Technologies LLC | Retractable card adapter |
7102214, | Dec 26 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Pre-molded leadframe |
7102891, | Jul 23 2003 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor |
7112875, | Feb 17 2005 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Secure digital memory card using land grid array structure |
7145238, | May 05 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package and substrate having multi-level vias |
7152801, | Apr 16 2004 | SanDisk Technologies LLC | Memory cards having two standard sets of contacts |
7185426, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Method of manufacturing a semiconductor package |
7193305, | Nov 03 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Memory card ESC substrate insert |
7201327, | Oct 18 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Memory card and its manufacturing method |
7220915, | Feb 17 2005 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Memory card and its manufacturing method |
7293716, | Feb 17 2005 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Secure digital memory card using land grid array structure |
7297562, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns |
7306160, | Jul 17 2003 | SanDisk Technologies LLC | Memory card with adapter |
7306161, | Jul 17 2003 | SanDisk Technologies LLC | Memory card with chamfer |
7307848, | Jul 17 2003 | SanDisk Technologies LLC | Memory card with raised portion |
7310692, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with integral covered second device connector for use with computing devices without a memory card slot |
7312103, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Method for making an integrated circuit substrate having laser-embedded conductive patterns |
7334326, | Jun 19 2001 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Method for making an integrated circuit substrate having embedded passive components |
7336498, | Jul 17 2003 | SanDisk Technologies LLC | Memory card with push-push connector |
7340540, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with contacts, device connector, and a connector covering mechanism |
7355860, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with two standard sets of contacts and a contact covering mechanism |
7358600, | May 01 2003 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Interposer for interconnecting components in a memory card |
7359204, | Feb 15 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Multiple cover memory card |
7364090, | Apr 16 2004 | SanDisk Technologies LLC | Memory cards having two standard sets of contacts |
7365006, | May 05 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package and substrate having multi-level vias fabrication method |
7375975, | Oct 31 2005 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Enhanced durability memory card |
7399661, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Method for making an integrated circuit substrate having embedded back-side access conductors and vias |
7416132, | Jul 17 2003 | SanDisk Technologies LLC | Memory card with and without enclosure |
7485491, | Feb 17 2005 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Secure digital memory card using land grid array structure |
7487265, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with two standard sets of contacts and a hinged contact covering mechanism |
7492601, | Apr 26 2002 | SanDisk Technologies LLC | Retractable card adapter |
7501338, | Jun 19 2001 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package substrate fabrication method |
7548430, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Buildup dielectric and metallization process and semiconductor package |
7550857, | Nov 16 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stacked redistribution layer (RDL) die assembly package |
7554813, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with two standard sets of contacts and a contact covering mechanism |
7556986, | Apr 21 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Tape supported memory card leadframe structure |
7589398, | Oct 04 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Embedded metal features structure |
7633763, | Jan 28 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Double mold memory card and its manufacturing method |
7633765, | Mar 23 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package including a top-surface metal layer for implementing circuit features |
7670962, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Substrate having stiffener fabrication method |
7671457, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package including top-surface terminals for mounting another semiconductor package |
7710736, | Aug 02 2005 | SanDisk Technologies LLC | Memory card with latching mechanism for hinged cover |
7719845, | Apr 26 2005 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Chamfered memory card module and method of making same |
7750250, | Dec 22 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Blind via capture pad structure |
7752752, | Jan 09 2007 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Method of fabricating an embedded circuit pattern |
7787243, | Apr 26 2002 | SanDisk Technologies LLC | Retractable card adapter |
7822883, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with two standard sets of contacts and a hinged contact covering mechanism |
7825520, | Nov 16 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stacked redistribution layer (RDL) die assembly package |
7837120, | Nov 29 2005 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Modular memory card and method of making same |
7864540, | Jul 17 2003 | SanDisk Technologies LLC | Peripheral card with sloped edges |
7911037, | Oct 04 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Method and structure for creating embedded metal features |
7960827, | Apr 09 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Thermal via heat spreader package and method |
8018068, | Mar 23 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package including a top-surface metal layer for implementing circuit features |
8026587, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package including top-surface terminals for mounting another semiconductor package |
8110909, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package including top-surface terminals for mounting another semiconductor package |
8203203, | Nov 16 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stacked redistribution layer (RDL) die assembly package |
8222538, | Jun 12 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable via package and method |
8227338, | Mar 23 2004 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package including a top-surface metal layer for implementing circuit features |
8294276, | May 27 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device and fabricating method thereof |
8300423, | May 25 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable treated via package and method |
8316536, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Multi-level circuit substrate fabrication method |
8322030, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns |
8323771, | Aug 15 2007 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Straight conductor blind via capture pad structure and fabrication method |
8337657, | Oct 27 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Mechanical tape separation package and method |
8338229, | Jul 30 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable plasma cleaned via package and method |
8341835, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Buildup dielectric layer having metallization pattern semiconductor package fabrication method |
8471154, | Aug 06 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable variable height via package and method |
8482134, | Nov 01 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable package and method |
8525318, | Nov 10 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device and fabricating method thereof |
8535961, | Dec 09 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Light emitting diode (LED) package and method |
8536462, | Jan 22 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Flex circuit package and method |
8557629, | Dec 03 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device having overlapped via apertures |
8623753, | May 28 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable protruding via package and method |
8629546, | Nov 16 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stacked redistribution layer (RDL) die assembly package |
8633598, | Sep 20 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Underfill contacting stacking balls package fabrication method and structure |
8653674, | Sep 15 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Electronic component package fabrication method and structure |
8671565, | Dec 22 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Blind via capture pad structure fabrication method |
8690283, | Oct 20 2009 | Western Digital Israel Ltd | Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device |
8704368, | Jun 12 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable via package and method |
8717775, | Aug 02 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Fingerprint sensor package and method |
8753730, | Oct 27 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Mechanical tape separation package |
8796561, | Oct 05 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Fan out build up substrate stackable package and method |
8826531, | Apr 05 2005 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Method for making an integrated circuit substrate having laminated laser-embedded circuit layers |
8872329, | Jan 09 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Extended landing pad substrate package structure and method |
8890329, | Apr 26 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device |
8890337, | Sep 20 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Column and stacking balls package fabrication method and structure |
8937381, | Dec 03 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Thin stackable package and method |
8941250, | Sep 15 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Electronic component package fabrication method and structure |
9012789, | Jun 12 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable via package and method |
9013011, | Mar 11 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stacked and staggered die MEMS package and method |
9029962, | Oct 12 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Molded cavity substrate MEMS package fabrication method and structure |
9177932, | Dec 03 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device having overlapped via apertures |
9391043, | Nov 20 2012 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device and manufacturing method thereof |
9462704, | Jan 09 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Extended landing pad substrate package structure and method |
9496210, | Nov 01 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable package and method |
9543242, | Aug 11 2015 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package and fabricating method thereof |
9691635, | May 01 2002 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Buildup dielectric layer having metallization pattern semiconductor package fabrication method |
9691734, | Dec 07 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Method of forming a plurality of electronic component packages |
9704747, | Mar 29 2013 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device and manufacturing method thereof |
9704842, | Nov 04 2013 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package |
9721872, | Feb 18 2011 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Methods and structures for increasing the allowable die size in TMV packages |
9728514, | Nov 20 2012 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device and manufacturing method thereof |
9730327, | Jun 12 2009 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Stackable via package and method |
9748154, | Nov 04 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Wafer level fan out semiconductor device and manufacturing method thereof |
9812386, | Aug 01 2006 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Encapsulated semiconductor package |
9837331, | Dec 03 2010 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device having overlapped via apertures |
9852976, | Aug 11 2015 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor package and fabricating method thereof |
9960328, | Sep 06 2016 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Semiconductor device and manufacturing method thereof |
D457887, | Sep 28 2001 | Sony Corporation | Recording medium |
D458935, | Feb 16 2001 | Kabushiki Kaisha Toshiba | Communications card |
D459355, | Mar 16 2001 | SD-3C, LLC | IC memory card |
D460456, | Mar 16 2001 | SD-3C, LLC | IC memory card |
D466872, | Jul 05 2001 | Sony Corporation | Cartridge |
D467586, | Mar 16 2001 | SD-3C, LLC | IC memory card |
D474774, | Feb 20 2002 | Olympus Corporation | IC card |
D475055, | Feb 20 2002 | Olympus Corporation | Portion of an IC card |
D475056, | Feb 20 2002 | Olympus Corporation | IC card |
D475711, | Feb 20 2002 | Olympus Corporation | Portion of an IC card |
D475712, | Feb 20 2002 | Olympus Corporation | Portion of an IC card |
D475713, | Feb 20 2002 | Olympus Corporation | IC card |
D475714, | Feb 20 2002 | Olympus Corporation | Portion of an IC card |
D476011, | Feb 20 2002 | Olympus Corporation | IC card |
D476012, | Feb 20 2002 | Olympus Corporation | IC card |
D479845, | Feb 20 2002 | Olympus Corporation | IC card |
D488475, | Dec 13 2002 | C-One Technology Corp.; Pretec Electronics Corp. | Removable electronic card |
D488476, | Dec 13 2002 | C-One Technology Corp.; Pretec Electronics Corp. | Removable dual-head electronic card |
D488477, | Dec 13 2002 | C-One Technology Corp.; Pretec Electronics Corp. | Removable electronic card |
D491951, | Dec 13 2002 | C-One Technology Corp.; Pretec Electronics Corp. | Removable electronic card |
D492686, | Dec 13 2002 | C-One Technology Corp.; Pretec Electronics Corp. | Removable dual-head electronic card |
D492687, | Dec 13 2002 | C-One Technology Corp.; Pretec Electronics Corp. | Removable electronic card |
D492688, | Dec 09 2002 | SanDisk Technologies LLC | Memory card |
D493466, | Oct 13 2003 | C-One Technology Corporation | Memory card |
D494180, | May 07 2003 | SD-3C, LLC | IC card |
D498760, | Dec 30 2003 | Siliconware Precision Industries Co., Ltd. | Digital memory card |
D499100, | Jun 10 2003 | TRIVIDIA HEALTH, INC | Removable memory module for a meter |
D505959, | Oct 15 2002 | SD-3C, LLC | IC memory card |
D507795, | Oct 15 2002 | SD-3C, LLC | IC memory card |
D510579, | Jan 15 2002 | SD-3C, LLC | IC memory card |
D510935, | Oct 15 2002 | SD-3C, LLC | IC memory card |
D515586, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with two sets of contacts |
D515587, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with two sets of contacts |
D517072, | Oct 15 2002 | SD-3C, LLC | IC memory card |
D518059, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with two sets of contacts |
D523435, | Jul 17 2003 | SD-3C, LLC | Memory card |
D525248, | Jul 17 2003 | SD-3C, LLC | Memory card |
D525623, | Jul 17 2003 | SD-3C, LLC | Memory card |
D525978, | Jul 17 2003 | SD-3C, LLC | Memory card |
D531181, | Apr 16 2004 | SanDisk Technologies LLC | Combined memory card and carrier assembly |
D532788, | Apr 16 2004 | SanDisk Technologies LLC | Combined memory card and carrier assembly |
D533556, | Oct 15 2002 | SD-3C, LLC | IC memory card |
D535297, | Apr 16 2004 | SanDisk Technologies LLC | Memory card with two sets of contacts |
D536382, | Apr 07 2004 | NINTENDO CO , LTD | Information storage cartridge for electronic game machine |
D537081, | Jul 17 2003 | SD-3C, LLC | Memory card |
D537824, | May 19 2005 | SanDisk Technologies LLC | Flash memory card with translucent cover |
D538286, | Jul 17 2003 | SD-3C, LLC | Memory card |
D542797, | Aug 02 2005 | SanDisk Technologies LLC | Memory card with a contact covering lid |
D552098, | May 24 2005 | Renesas Electronics Corporation | Memory card |
D552099, | May 24 2005 | Renesas Electronics Corporation | Memory card |
D552612, | May 24 2005 | Renesas Electronics Corporation | Memory card |
D554123, | May 19 2005 | SanDisk Technologies LLC | Flash memory card with a translucent cover |
D556764, | May 24 2005 | Renesas Electronics Corporation | Memory card |
D579940, | Mar 15 2007 | PULSE DATA INVESTMENTS INC INVESTISSEMENTS PULSE DATA INC ; TECHNOLOGIES HUMANWARE INC | Cartridge |
D581932, | May 24 2005 | Renesas Electronics Corporation | Memory card |
D585068, | Nov 09 2007 | Vizio, Inc | Memory card with contact exposing openings |
D588133, | Dec 17 2007 | Panasonic Corporation | IC memory card |
D588134, | Jan 11 2008 | Panasonic Corporation | IC memory card |
D588135, | Apr 01 2008 | Panasonic Corporation | IC memory card |
D588597, | Dec 17 2007 | Panasonic Corporation | IC memory card |
D588598, | Apr 01 2008 | Panasonic Corporation | IC memory card |
D588599, | Apr 01 2008 | Panasonic Corporation | IC memory card |
D628202, | Oct 20 2009 | SanDisk Technologies LLC | MicroSD memory card with different color surfaces |
D638431, | Oct 20 2009 | SanDisk Technologies LLC | MicroSD memory card with a semi-transparent color surface |
D639302, | May 17 2010 | Panasonic Corporation | Memory card |
D639812, | May 17 2010 | Panasonic Corporation | Memory card |
D643040, | Oct 26 2010 | Hon Hai Precision Ind. Co., Ltd. | Electrical card |
D643431, | May 17 2010 | Panasonic Corporation | Memory card |
D643432, | May 17 2010 | Panasonic Corporation | Memory card |
D667830, | Nov 29 2011 | Samsung Electronics Co., Ltd. | SD memory card |
D670292, | May 17 2011 | Sony Computer Entertainment Inc | Recording medium |
D700183, | Aug 30 2012 | Nifty Drives Ltd | Computer accessory |
D704192, | Aug 30 2012 | Nifty Drives Ltd | Computer accessory |
D726189, | Apr 03 2014 | Transcend Information, Inc. | Secure digital card |
RE47112, | Oct 20 2009 | Western Digital Israel Ltd | Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device |
Patent | Priority | Assignee | Title |
6097605, | Nov 25 1995 | Stocko Metallwaren Fabriken Henkels und Sohn GmbH & Co. | Contacting unit for card-shaped support elements for electronic components |
6108209, | Jul 24 1995 | GLOBALFOUNDRIES Inc | Snap together PCMCIA cards with laser tack welded seams |
D267714, | Feb 01 1980 | Victor Company of Japan, Limited | Pre-recorded cartridge video/audio disk |
D311391, | Sep 08 1987 | Kabushiki Kaisha Toshiba | Data recording cartridge for language learning machine |
D368082, | May 07 1994 | Sony Computer Entertainment Inc | Memory card |
D369156, | Sep 20 1994 | Kabushiki Kaisha Toshiba | IC Card |
D369157, | Mar 16 1995 | Kabushiki Kaisha Toshiba | IC card |
D371548, | Nov 30 1993 | Kabushiki Kaisha Toshiba | Optical disk cartridge |
D374436, | Nov 30 1993 | Kabushiki Kaisha Toshiba | Optical disk cartridge |
D375941, | Dec 08 1992 | International Business Machines Corp | Top, front, rear, left and right sides of an enlarged jacketed circuit card |
D377344, | Nov 30 1993 | Kabushiki Kaisha Toshiba | Optical disk cartridge |
D405441, | Sep 04 1997 | CITIZEN HOLDINGS CO , LTD | IC card |
D407392, | Jun 23 1997 | Infineon Technologies AG | Chipcard |
D410913, | Oct 13 1997 | CITIZEN HOLDINGS CO , LTD | LC card |
D415132, | Apr 08 1998 | Honda Tsushin Kogyo Co., Ltd. | Memory card |
D416886, | Dec 24 1998 | Honda Tsushin Kogyo Co., Ltd. | Compact flash card |
D417212, | Aug 06 1997 | Sony Corporation | Case for semiconductor element |
JP1038035, | |||
JP923611, | |||
JP953684, | |||
JP9536841, | |||
XHM40547, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 23 2000 | Kabushiki Kaisha Toshiba | (assignment on the face of the patent) | / | |||
Feb 23 2000 | Matsushita Electric Industrial Co. | (assignment on the face of the patent) | / | |||
Feb 23 2000 | SanDisk Corporation | (assignment on the face of the patent) | / | |||
Sep 25 2000 | OKAMOTO, KOSEI | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011407 | /0495 | |
Oct 13 2000 | TORRI, TAKASHI | Matsushita Electric Industrial Co | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011407 | /0482 | |
Nov 12 2000 | PINTO, YOSHI | SanDisk Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011407 | /0979 | |
Nov 13 2000 | WALLACE, BOB | SanDisk Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011407 | /0979 | |
Nov 13 2000 | CEDAR, YORAM | SanDisk Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011407 | /0979 | |
Nov 15 2000 | AUCLAIR, DAN | SanDisk Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011407 | /0979 | |
Oct 10 2007 | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | SD-3C, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 020627 | /0098 | |
Oct 23 2007 | Toshiba Corporation | SD-3C, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 020627 | /0098 | |
Oct 26 2007 | SanDisk Corporation | SD-3C, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 020627 | /0098 |
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