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The ornamental design for an ic memory card, a shown and described.
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FIG. 1 is a perspective view of a first embodiment of an IC memory card showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof
FIG. 8 is a cross sectional view along line 8—8 of FIG. 2;
FIG. 9 is a cross sectional view along line 9—9 of FIG. 2;
FIG. 10 is a perspective view of a second embodiment of an IC memory card showing our new design;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a rear elevational view thereof;
FIG. 13 is a left side view thereof;
FIG. 14 is a right side view thereof;
FIG. 15 is a top plan view thereof;
FIG. 16 is a bottom plan view thereof;
FIG. 17 is a cross sectional view along line 17—17 of FIG. 11; and,
FIG. 18 is a cross sectional view along line 18—18 of FIG. 11.
Yamada, Hiroyuki, Nakamura, Yutaka, Sakamoto, Hiroyuki, Miller, Robert, Takiar, Hem
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 24 2004 | Matsushita Electric Industrial Co., Ltd. | (assignment on the face of the patent) | / | |||
Jun 24 2004 | Kabushiki Kaisha Toshiba | (assignment on the face of the patent) | / | |||
Jun 24 2004 | SanDisk Corporation | (assignment on the face of the patent) | / | |||
Oct 10 2007 | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | SD-3C, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 020627 | /0098 | |
Oct 23 2007 | Toshiba Corporation | SD-3C, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 020627 | /0098 | |
Oct 26 2007 | SanDisk Corporation | SD-3C, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 020627 | /0098 |
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