|
The ornamental design for a circuit block for power supply, as shown and described.
|
|||||||||||||||||
FIG. 1 is a front perspective view of the circuit block for power supply showing our new design;
FIG. 2 is a front elevational view;
FIG. 3 is a rear elevational view;
FIG. 4 is a top plan view;
FIG. 5 is a bottom plan view; and,
FIG. 6 is a right-side elevational view.
The left-side elevational view is symmetry of the right-side elevational view.
Watanabe, Osamu, Kobayashi, Toshihiko, Kondo, Junji
| Patent | Priority | Assignee | Title |
| D595649, | May 15 2008 | Enclosure for built-in power supply | |
| D665741, | Dec 24 2011 | INGRASYS TECHNOLOGY INC | Power supply cover |
| D738834, | Jul 29 2014 | Driver circuit integrated LED module | |
| D797049, | Apr 27 2016 | IDEAL INDUSTRIES, INC | Housing with a heat sink for an electrical connector |
| D810022, | Apr 27 2016 | IDEAL INDUSTRIES, INC | Housing with a heat sink for an electrical connector |
| D855577, | Apr 12 2018 | Telebox Industries Corp. | Circuit board for electrical connector |
| D967026, | Sep 06 2021 | Power mounting block | |
| ER1462, |
| Patent | Priority | Assignee | Title |
| 3575546, | |||
| 4594644, | Oct 22 1984 | Electronic Instrument & Specialty Corp. | Electrical component encapsulation package |
| 4788626, | Feb 15 1986 | Brown, Boveri & Cie AG | Power semiconductor module |
| 4814943, | Jun 04 1986 | Oki Electric Industry Co., Ltd. | Printed circuit devices using thermoplastic resin cover plate |
| 5241133, | Dec 21 1990 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Leadless pad array chip carrier |
| 5526234, | Jul 17 1992 | VLT, INC | Packaging electrical components |
| 5731222, | Aug 01 1995 | OL SECURITY LIMITED LIABILITY COMPANY | Externally connected thin electronic circuit having recessed bonding pads |
| 6054759, | Jan 08 1998 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor chip and package with heat dissipation |
| 6194782, | Jun 24 1998 | Nortel Networks Limited | Mechanically-stabilized area-array device package |
| D358804, | Sep 02 1993 | SGS-Thomson Microelectronics, Inc | Detachable integrated circuit module |
| D395423, | Mar 13 1997 | Sony Corporation | Semiconductor package |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| May 23 2000 | WANTABE, OSAMU | TAMURA CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010877 | /0527 | |
| May 23 2000 | KONDO, JUNJI | TAMURA CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010877 | /0527 | |
| May 23 2000 | KOBOYASHI, TOSHIHIKO | TAMURA CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010877 | /0527 | |
| Jun 20 2000 | Tamura Coroportion | (assignment on the face of the patent) | / |
| Date | Maintenance Fee Events |
| Date | Maintenance Schedule |