Patent
   D453141
Priority
Apr 24 2000
Filed
Jun 20 2000
Issued
Jan 29 2002
Expiry
Jan 29 2016
Assg.orig
Entity
unknown
7
11
n/a
The ornamental design for a circuit block for power supply, as shown and described.

FIG. 1 is a front perspective view of the circuit block for power supply showing our new design;

FIG. 2 is a front elevational view;

FIG. 3 is a rear elevational view;

FIG. 4 is a top plan view;

FIG. 5 is a bottom plan view; and,

FIG. 6 is a right-side elevational view.

The left-side elevational view is symmetry of the right-side elevational view.

Watanabe, Osamu, Kobayashi, Toshihiko, Kondo, Junji

Patent Priority Assignee Title
D595649, May 15 2008 Enclosure for built-in power supply
D665741, Dec 24 2011 INGRASYS TECHNOLOGY INC Power supply cover
D738834, Jul 29 2014 Driver circuit integrated LED module
D797049, Apr 27 2016 IDEAL INDUSTRIES, INC Housing with a heat sink for an electrical connector
D810022, Apr 27 2016 IDEAL INDUSTRIES, INC Housing with a heat sink for an electrical connector
D855577, Apr 12 2018 Telebox Industries Corp. Circuit board for electrical connector
D967026, Sep 06 2021 Power mounting block
Patent Priority Assignee Title
3575546,
4594644, Oct 22 1984 Electronic Instrument & Specialty Corp. Electrical component encapsulation package
4788626, Feb 15 1986 Brown, Boveri & Cie AG Power semiconductor module
4814943, Jun 04 1986 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
5241133, Dec 21 1990 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Leadless pad array chip carrier
5526234, Jul 17 1992 VLT, INC Packaging electrical components
5731222, Aug 01 1995 OL SECURITY LIMITED LIABILITY COMPANY Externally connected thin electronic circuit having recessed bonding pads
6054759, Jan 08 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor chip and package with heat dissipation
6194782, Jun 24 1998 Nortel Networks Limited Mechanically-stabilized area-array device package
D358804, Sep 02 1993 SGS-Thomson Microelectronics, Inc Detachable integrated circuit module
D395423, Mar 13 1997 Sony Corporation Semiconductor package
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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 23 2000WANTABE, OSAMUTAMURA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0108770527 pdf
May 23 2000KONDO, JUNJITAMURA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0108770527 pdf
May 23 2000KOBOYASHI, TOSHIHIKOTAMURA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0108770527 pdf
Jun 20 2000Tamura Coroportion(assignment on the face of the patent)
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