Patent
   D358804
Priority
Sep 02 1993
Filed
Sep 02 1993
Issued
May 30 1995
Expiry
May 30 2009
Assg.orig
Entity
unknown
4
9
n/a
The ornamental design for the detachable integrated circuit module, as shown and described.

FIG. 1 is a perspective view of the detachable integrated circuit module illustrating its cooperative relationship with a packaged integrated circuit. The broken line showing of the packaged integrated circuit is included for the purpose of illustrating an environmental element only, and forms no part of the claimed design;

FIGS. 2 and 3 are opposing side elevation views of the detachable module;

FIG. 4 is an end elevation view of the detachable module from its end nearer the lockout key;

FIG. 5 is an end elevation view of the detachable module from its end opposite that from the lockout key;

FIG. 6 is a top plan view of the detachable module; and,

FIG. 7 is a bottom plan view of the detachable module.

Siegel, Harry M., Kelappan, Krishnan, Hundt, Michael J.

Patent Priority Assignee Title
D453141, Apr 24 2000 Tamura Coroportion Circuit block for power supply
D453142, Apr 24 2000 TAMURA CORPORATION Circuit block for power supply
D739350, Aug 30 2013 TAMURA CORPORATION Power circuit block
D787450, Dec 04 2014 Omron Corporation Electric relay
Patent Priority Assignee Title
3501582,
3650232,
4107555, Mar 05 1976 Robert Bosch GmbH Proximity switch and circuit system
4149028, Apr 21 1977 Bell Telephone Laboratories, Incorporated Customer service closures
4920444, Oct 09 1987 Carmis Enterprises S.A.; CARMIS ENTERPRISES S A , C O TORELLO & TORELLO, Arrangement for decoupling integrated circuits electrically
4935581, Apr 17 1986 Citizen Watch Co., Ltd. Pin grid array package
5038253, May 14 1990 Motorola, Inc.; MOTOROLA, INC , A CORP OF DE Transceiver mounting assembly having integrally formed lock
5130881, Jan 11 1988 UNITED STATES OF AMERICA, THE, AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE IC socket having overvoltage protection
5131535, Jun 27 1986 SYM-TEK INCORPORATED OF MINNESOTA Electrical device transport medium
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 02 1993SGS-Thomson Microelectronics, Inc.(assignment on the face of the patent)
Sep 02 1993SIEGEL, HARRY M SGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068400586 pdf
Sep 02 1993HUNDT, MICHAEL J SGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068400586 pdf
Sep 02 1993KELAPPAN, KRISHNANSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068400586 pdf
Dec 01 1993SIEGEL, HARRY MICHAELSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0067900295 pdf
Dec 01 1993HUNDT, MICHAEL J SGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0067900295 pdf
Dec 01 1993KELAPPAN, KRISHNANSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0067900295 pdf
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