Patent
   D453142
Priority
Apr 24 2000
Filed
Jun 20 2000
Issued
Jan 29 2002
Expiry
Jan 29 2016
Assg.orig
Entity
unknown
16
11
n/a
The ornamental design for a circuit block for power supply, as shown and described.

FIG. 1 is a front perspective view of the circuit block for power supply showing our new design;

FIG. 2 is a front elevational view;

FIG. 3 is a rear elevational view;

FIG. 4 is a top plan view;

FIG. 5 is a bottom plan view; and,

FIG. 6 is a right-side elevational view.

The left-side elevational view is symmetry of the right-side elevational view.

Watanabe, Osamu, Kobayashi, Toshihiko, Kondo, Junji

Patent Priority Assignee Title
10312704, Oct 22 2001 Apple Inc. Power adapters for powering and/or charging peripheral devices
11399995, Feb 23 2016 DEKA Products Limited Partnership Mobility device
11679044, Feb 23 2016 DEKA Products Limited Partnership Mobility device
11794722, Feb 23 2016 DEKA Products Limited Partnership Mobility device
8674558, Oct 22 2001 Apple Inc. Power adapters for powering and/or charging peripheral devices
D552030, Apr 12 2006 Black & Decker Inc Power supply for a light housing
D660231, Sep 10 2010 JIJ-Plast AB Magnetic searching system for electrical boxes
D738834, Jul 29 2014 Driver circuit integrated LED module
D739350, Aug 30 2013 TAMURA CORPORATION Power circuit block
D797049, Apr 27 2016 IDEAL INDUSTRIES, INC Housing with a heat sink for an electrical connector
D810022, Apr 27 2016 IDEAL INDUSTRIES, INC Housing with a heat sink for an electrical connector
D855577, Apr 12 2018 Telebox Industries Corp. Circuit board for electrical connector
D926131, Jul 13 2018 DEKA Products Limited Partnership Powerbase housing
D946522, Jul 13 2018 DEKA Products Limited Partnership Powerbase housing
D967026, Sep 06 2021 Power mounting block
D981957, Jul 13 2018 DEKA Products Limited Partnership Powerbase housing
Patent Priority Assignee Title
3575546,
4594644, Oct 22 1984 Electronic Instrument & Specialty Corp. Electrical component encapsulation package
4788626, Feb 15 1986 Brown, Boveri & Cie AG Power semiconductor module
4970576, May 23 1987 IXYS Corporation Power semiconductor module and method for producing the module
5241133, Dec 21 1990 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Leadless pad array chip carrier
5526234, Jul 17 1992 VLT, INC Packaging electrical components
5970191, Mar 27 1996 MITSUBISHI GAS CHEMICAL COMPANY, INC; FUJI ELECTRIC CO , LTD Optical signal distributors
6150715, Aug 05 1997 Renesas Electronics Corporation Semiconductor device with radiation plate for high radiation character and method of manufacturing the same
6194782, Jun 24 1998 Nortel Networks Limited Mechanically-stabilized area-array device package
D358804, Sep 02 1993 SGS-Thomson Microelectronics, Inc Detachable integrated circuit module
D395638, Jan 30 1997 Sony Corporation Semiconductor package
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
May 23 2000WATANABE, OSAMUTAMURA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0108770502 pdf
May 23 2000KONDO, JUNJITAMURA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0108770502 pdf
May 23 2000KOBAYASHI, TOSHIHIKOTAMURA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0108770502 pdf
Jun 20 2000TAMURA CORPORATION(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule