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The ornamental design for a circuit block for power supply, as shown and described.
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FIG. 1 is a front perspective view of the circuit block for power supply showing our new design;
FIG. 2 is a front elevational view;
FIG. 3 is a rear elevational view;
FIG. 4 is a top plan view;
FIG. 5 is a bottom plan view; and,
FIG. 6 is a right-side elevational view.
The left-side elevational view is symmetry of the right-side elevational view.
Watanabe, Osamu, Kobayashi, Toshihiko, Kondo, Junji
Patent | Priority | Assignee | Title |
10312704, | Oct 22 2001 | Apple Inc. | Power adapters for powering and/or charging peripheral devices |
11399995, | Feb 23 2016 | DEKA Products Limited Partnership | Mobility device |
11679044, | Feb 23 2016 | DEKA Products Limited Partnership | Mobility device |
11794722, | Feb 23 2016 | DEKA Products Limited Partnership | Mobility device |
8674558, | Oct 22 2001 | Apple Inc. | Power adapters for powering and/or charging peripheral devices |
D552030, | Apr 12 2006 | Black & Decker Inc | Power supply for a light housing |
D660231, | Sep 10 2010 | JIJ-Plast AB | Magnetic searching system for electrical boxes |
D738834, | Jul 29 2014 | Driver circuit integrated LED module | |
D739350, | Aug 30 2013 | TAMURA CORPORATION | Power circuit block |
D797049, | Apr 27 2016 | IDEAL INDUSTRIES, INC | Housing with a heat sink for an electrical connector |
D810022, | Apr 27 2016 | IDEAL INDUSTRIES, INC | Housing with a heat sink for an electrical connector |
D855577, | Apr 12 2018 | Telebox Industries Corp. | Circuit board for electrical connector |
D926131, | Jul 13 2018 | DEKA Products Limited Partnership | Powerbase housing |
D946522, | Jul 13 2018 | DEKA Products Limited Partnership | Powerbase housing |
D967026, | Sep 06 2021 | Power mounting block | |
D981957, | Jul 13 2018 | DEKA Products Limited Partnership | Powerbase housing |
Patent | Priority | Assignee | Title |
3575546, | |||
4594644, | Oct 22 1984 | Electronic Instrument & Specialty Corp. | Electrical component encapsulation package |
4788626, | Feb 15 1986 | Brown, Boveri & Cie AG | Power semiconductor module |
4970576, | May 23 1987 | IXYS Corporation | Power semiconductor module and method for producing the module |
5241133, | Dec 21 1990 | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | Leadless pad array chip carrier |
5526234, | Jul 17 1992 | VLT, INC | Packaging electrical components |
5970191, | Mar 27 1996 | MITSUBISHI GAS CHEMICAL COMPANY, INC; FUJI ELECTRIC CO , LTD | Optical signal distributors |
6150715, | Aug 05 1997 | Renesas Electronics Corporation | Semiconductor device with radiation plate for high radiation character and method of manufacturing the same |
6194782, | Jun 24 1998 | Nortel Networks Limited | Mechanically-stabilized area-array device package |
D358804, | Sep 02 1993 | SGS-Thomson Microelectronics, Inc | Detachable integrated circuit module |
D395638, | Jan 30 1997 | Sony Corporation | Semiconductor package |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 23 2000 | WATANABE, OSAMU | TAMURA CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010877 | /0502 | |
May 23 2000 | KONDO, JUNJI | TAMURA CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010877 | /0502 | |
May 23 2000 | KOBAYASHI, TOSHIHIKO | TAMURA CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010877 | /0502 | |
Jun 20 2000 | TAMURA CORPORATION | (assignment on the face of the patent) | / |
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