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The ornamental design for a tray for semiconductor packaging, as shown and described.
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FIG. 1 is a top plan view of a tray for semiconductor packaging showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and,
FIG. 6 is a front elevational view thereof.
Soh, Swee Chuan, Lim, Tee Hock, Goh, Geap Wooi, Hassan, Shuib Bin
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 26 2001 | Texchem-Pack (M) SDN BHD | (assignment on the face of the patent) | / | |||
Feb 02 2001 | SOH, SWEE CHUAN | TEXCHEM-PACK M SDN BHD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011678 | /0812 | |
Feb 02 2001 | LIM, TEE HOCK | TEXCHEM-PACK M SDN BHD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011678 | /0812 | |
Feb 02 2001 | GOH, GEAP WOOI | TEXCHEM-PACK M SDN BHD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011678 | /0812 | |
Feb 02 2001 | HASSAN, SHUIB BIN | TEXCHEM-PACK M SDN BHD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011678 | /0812 | |
May 07 2002 | TEXCHEM-PACK M SDN BHD | TEXCHEM-PACK M BHD | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 013269 | /0541 |
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