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The ornamental design for a tray for shipping electronic components, as shown and described herein.
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FIG. (1) is a perspective view of the bottom of the tray for shipping electronic components according to the invention;
FIG. (2) is a top view of the tray for shipping electronic components according to the invention with an opaque shipping layer in place;
FIG. (3) is a top view of the tray for shipping electronic components according to the invention;
FIG. (4) is bottom view of the tray for shipping electronic components;
FIG. (5) is a left side view of the tray for shipping electronic components according to the invention, the right side view being a mirror image thereof;
FIG. (6) is a top end view of the tray for shipping electronic components according to the invention, the bottom end view being a mirror image thereof; and,
FIG. (7) is a cross-section taken along lines 7-7 of
Nelissen, Franciscus Petrus Nicolaas
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Apr 29 2008 | Premier Farnell UK Limited | (assignment on the face of the patent) | / |
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