Patent
   D466140
Priority
Oct 31 2001
Filed
Oct 31 2001
Issued
Nov 26 2002
Expiry
Nov 26 2016
Assg.orig
Entity
unknown
6
2
n/a
The ornamental design for a tool for dispensing adhesives and sealants, as shown and described.

FIG. 1 is a front elevational view of the new design for a tool for dispensing adhesives and sealants;

FIG. 2 is a top plan view;

FIG. 3 is a bottom view;

FIG. 4 is a right side elevational view;

FIG. 5 is a left side elevational view;

FIG. 6 is a rear elevational view;

FIG. 7 is a perspective view; and,

FIG. 8 is a bottom perspective view.

Huey, Brett

Patent Priority Assignee Title
8956923, Jun 18 2012 SAMSUNG ELECTRONICS CO , LTD Methods of fabricating semiconductor devices and underfill equipment for the same
D473883, Jun 14 2002 Nordson Corporation Tool for dispensing adhesives, sealants, and underfill materials
D474214, Jun 14 2002 Nordson Corporation Tool for dispensing adhesives, sealants, and underfill materials
D520538, Apr 14 2004 Nordson Corporation Nozzle
D824968, Oct 30 2016 Nordson Corporation Hot melt dispenser
D851694, Oct 30 2016 Nordson Corporation Hot melt dispenser
Patent Priority Assignee Title
D365830, Nov 08 1993 Nordson Corporation Fluid dispensing module for dispensing heated fluids, such as hot melt adhesives, sealants, or caulks
D429263, Jul 21 1999 Nordson Corporation Liquid dispensing gun and manifold
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 26 2001HUEY, BRETTNordson CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0123540979 pdf
Oct 31 2001Nordson Corporation(assignment on the face of the patent)
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