Patent
   D474214
Priority
Jun 14 2002
Filed
Jun 14 2002
Issued
May 06 2003
Expiry
May 06 2017
Assg.orig
Entity
unknown
4
3
n/a
The ornamental design for a tool for dispensing adhesives, sealants, and underfill materials, as shown and described.

FIG. 1 is an elevational view of a first end for the new design for a tool for dispensing adhesives, sealants, and underfill material;

FIG. 2 is a top plan view of the tool as shown in FIG. 1;

FIG. 3 is a bottom view;

FIG. 4 is a right side elevational view wherein the left elevational view is a mirror image; and,

FIG. 5 is a rear elevational view.

Padgett, David N., Huey, Brett

Patent Priority Assignee Title
8956923, Jun 18 2012 SAMSUNG ELECTRONICS CO , LTD Methods of fabricating semiconductor devices and underfill equipment for the same
D520538, Apr 14 2004 Nordson Corporation Nozzle
D824968, Oct 30 2016 Nordson Corporation Hot melt dispenser
D851694, Oct 30 2016 Nordson Corporation Hot melt dispenser
Patent Priority Assignee Title
D365830, Nov 08 1993 Nordson Corporation Fluid dispensing module for dispensing heated fluids, such as hot melt adhesives, sealants, or caulks
D429263, Jul 21 1999 Nordson Corporation Liquid dispensing gun and manifold
D466140, Oct 31 2001 Nordson Corporation Tool for dispensing adhesives and sealants
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 07 2002HUEY, BRETTNordson CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0130170328 pdf
Jun 07 2002PADGETT, DAVID N Nordson CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0130170328 pdf
Jun 14 2002Nordson Corporation(assignment on the face of the patent)
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