|
The ornamental design for a tool for dispensing adhesives, sealants, and underfill materials, as shown and described.
|
FIG. 1 is an elevational view of a first end for the new design for a tool for dispensing adhesives, sealants, and underfill material;
FIG. 2 is a top plan view of the tool as shown in FIG. 1;
FIG. 3 is a bottom view;
FIG. 4 is a right side elevational view wherein the left elevational view is a mirror image; and,
FIG. 5 is a rear elevational view.
Padgett, David N., Huey, Brett
Patent | Priority | Assignee | Title |
8956923, | Jun 18 2012 | SAMSUNG ELECTRONICS CO , LTD | Methods of fabricating semiconductor devices and underfill equipment for the same |
D520538, | Apr 14 2004 | Nordson Corporation | Nozzle |
D824968, | Oct 30 2016 | Nordson Corporation | Hot melt dispenser |
D851694, | Oct 30 2016 | Nordson Corporation | Hot melt dispenser |
Patent | Priority | Assignee | Title |
D365830, | Nov 08 1993 | Nordson Corporation | Fluid dispensing module for dispensing heated fluids, such as hot melt adhesives, sealants, or caulks |
D429263, | Jul 21 1999 | Nordson Corporation | Liquid dispensing gun and manifold |
D466140, | Oct 31 2001 | Nordson Corporation | Tool for dispensing adhesives and sealants |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 07 2002 | HUEY, BRETT | Nordson Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013017 | /0328 | |
Jun 07 2002 | PADGETT, DAVID N | Nordson Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013017 | /0328 | |
Jun 14 2002 | Nordson Corporation | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |