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We claim the ornamental design for a communication module, as shown and described.
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FIG. 1 is a perspective view illustrating the top, front and right side of a design for the communication module, the broken-line disclosure of a connector being for illustrative purposes only and forming no part of the claimed design;
FIG. 2 is a front elevational view thereof, the broken-line disclosure being for illustrative purposes only and forming no part of the claimed design;
FIG. 3 is a top plan view thereof;
FIG. 4 is right side elevational view thereof, with the opposite side being a mirror image;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is front elevational view thereof, without the broken line disclosure illustrated in FIG. 2.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 27 2001 | STACK, RICHARD | XANOPTIX, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011962 | /0895 | |
Jun 27 2001 | DUGAS, ROGER | XANOPTIX, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011962 | /0895 | |
Jun 29 2001 | Xanoptix, Inc. | (assignment on the face of the patent) | / | |||
Oct 19 2004 | XANOPTIX, INC | XAN3D TECHNOLOGIES, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 021242 | /0129 | |
Aug 16 2005 | XAN3D TECHNOLOGIES, INC | CUBIC WAFER, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 021242 | /0868 | |
Mar 21 2008 | CUBIC WAFER, INC | CUFER ASSET LTD L L C | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 021171 | /0617 |
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