Patent
   D563327
Priority
Aug 17 2005
Filed
Feb 07 2006
Issued
Mar 04 2008
Expiry
Mar 04 2022
Assg.orig
Entity
unknown
6
28
n/a
The ornamental design for a resin-packaged optical communication module, as shown and described.

FIG. 1 is a front elevation of a resin-packaged optical communication module showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a rear elevation thereof;

FIG. 5 is a left side elevation thereof;

FIG. 6 is a right side elevation thereof; and,

FIG. 7 is a cross-section thereof taken along line 77 in FIG. 2.

Horio, Tomoharu

Patent Priority Assignee Title
8148735, Mar 07 2005 ROHM CO , LTD Optical communication module
D879767, May 30 2017 KOHOKU KOGYO CO., LTD. Optical communication module
D879768, May 30 2017 KOHOKU KOGYO CP., LTD. Optical communication module
D908606, Jul 24 2018 Sharp Kabushiki Kaisha Dye-sensitized solar cell module
D910539, Jul 24 2018 Sharp Kabushiki Kaisha Communication module with solar cell
D925441, Jul 24 2018 Sharp Kabushiki Kaisha; KOBATA GAUGE MANUFACTURING CO , LTD Data transmitter with solar cell and sensor
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 26 2006HORIO, TOMOHARUROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0175480312 pdf
Feb 07 2006Rohm Co., Ltd.(assignment on the face of the patent)
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