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Patent
   D475021
Priority
Jul 23 2001
Filed
Jul 23 2001
Issued
May 27 2003
Expiry
May 27 2017
Inventors
White, Jos…
Assg.orig
Hewlett Pa…
Hewlett-Pa…
Assg.curr
Hewlett Pa…
Entity
unknown
Referenced by
7
References
10
Maint.:
n/a
The ornamental design for an electrical contact, as shown and described.

FIG. 1 is an oblique view of an electrical contact showing the new design.

FIG. 2 is a top view of the electric contact of FIG. 1.

FIG. 3 is an oblique view of an alternate embodiment of the electrical contact of FIG. 1; and,

FIG. 4 is a top view of the electric contact of FIG. 3.

The broken line showing the through-plated hole and surrounding metal in FIGS. 1 through 4 is for illustrative purposes only and forms no part of the claimed design.
INVENTORS:

White, Joseph M, Clements, Bradley E

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
7752738, Dec 17 2004 Palo Alto Research Center Incorporated Methods for fabricating thin complaint spring contacts
D521455, Sep 23 2004 NEOCONIX, INC Electrical connector flange
D521940, Sep 23 2004 NEOCONIX, INC Electrical connector flange
D522461, Sep 23 2004 NEOCONIX, INC Electrical connector flange
D522972, Apr 04 2005 Neoconix, Inc.; NEOCONIX, INC Electrical contact flange
D524756, Sep 23 2004 NEOCONIX, INC Electrical connector flange
D525207, Dec 02 2003 IDI SEMI, LLC; INTERCONNECT DEVICES, INC Sheet metal interconnect array
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
1329770,
3659035,
3942245, Nov 20 1971 Plessey SemiConductors Limited Related to the manufacture of lead frames and the mounting of semiconductor devices thereon
4062547, Aug 13 1976 Matsushita Electric Corporation of America Automatic control for phonographs playing records of different speeds
4924353, Dec 20 1985 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
5243138, Mar 15 1990 DaimlerChrysler Aerospace Airbus GmbH Device for securing a plurality of individual electrical conductors in a bundle to form a cable
5388992, Jun 19 1991 Audiological Engineering Corporation Method and apparatus for tactile transduction of acoustic signals from television receivers
6286205, Aug 28 1995 Tessera, Inc. Method for making connections to a microelectronic device having bump leads
6326905, Aug 10 1999 Detection Systems, Inc. Coded rotary switch with contacts at common radius
D365084, Aug 10 1994 SAMSUNG ELECTRONICS CO , LTD Solder pad for printed circuit boards
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 23 2001Hewlett Packard Development Company, L.P.(assignment on the face of the patent)
Jul 23 2001CLEMENTS, BRADLEY E Hewlett-Packard CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0125490750 pdf
Jul 23 2001WHITE, JOSEPH M Hewlett-Packard CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0125490750 pdf
Jul 28 2003Hewlett-Packard CompanyHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0138620623 pdf
Oct 27 2015HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Hewlett Packard Enterprise Development LPASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0370790001 pdf
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