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The ornamental design for an electrical connector flange, as substantially shown and described.
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FIG. 1 is a perspective view of an electrical connector flange showing my new design;
FIG. 2 is a top view of the electrical connector flange showing line VI—VI;
FIG. 3 is a bottom view of the electrical connector flange;
FIG. 4 is a front view of the electrical connector flange;
FIG. 5 is a side view of the electrical connector flange; and,
FIG. 6 is a representative cross-sectional view of one of the depicted fingers of the electrical connector flange, taken along line VI—VI shown in FIG. 2.
The broken line showing of is for illustrative purposes only and forms no part of the claimed design.
Patent | Priority | Assignee | Title |
10175631, | May 10 2017 | Xerox Corporation | Earth plate with breakaway rotated tabs |
7347698, | Mar 19 2004 | NEOCONIX, INC | Deep drawn electrical contacts and method for making |
7354276, | Jul 20 2004 | NEOCONIX, INC | Interposer with compliant pins |
7357644, | Dec 12 2005 | NEOCONIX, INC | Connector having staggered contact architecture for enhanced working range |
7371073, | Apr 11 2003 | NEOCONIX, INC | Contact grid array system |
7383632, | Mar 19 2004 | NEOCONIX, INC | Method for fabricating a connector |
7587817, | Nov 03 2005 | Neoconix, Inc. | Method of making electrical connector on a flexible carrier |
7597561, | Apr 11 2003 | NEOCONIX, INC | Method and system for batch forming spring elements in three dimensions |
7621756, | Oct 29 2007 | Neoconix, Inc. | Contact and method for making same |
7625220, | Apr 11 2003 | System for connecting a camera module, or like device, using flat flex cables | |
7628617, | Jun 11 2003 | NEOCONIX, INC | Structure and process for a contact grid array formed in a circuitized substrate |
7645147, | Mar 19 2004 | Neoconix, Inc. | Electrical connector having a flexible sheet and one or more conductive connectors |
7758351, | Apr 11 2003 | NEOCONIX, INC | Method and system for batch manufacturing of spring elements |
7891988, | Apr 11 2003 | Neoconix, Inc. | System and method for connecting flat flex cable with an integrated circuit, such as a camera module |
7989945, | Dec 08 2003 | NEOCONIX, INC | Spring connector for making electrical contact at semiconductor scales |
8584353, | Apr 11 2003 | NEOCONIX, INC | Method for fabricating a contact grid array |
8641428, | Dec 02 2011 | Neoconix, Inc. | Electrical connector and method of making it |
9680273, | Mar 15 2013 | NEOCONIX, INC | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
D573947, | Oct 05 2005 | GS YUASA INTERNATIONAL LTD | Current collecting lead |
D573948, | Oct 05 2005 | GS YUASA INTERNATIONAL LTD | Current collecting lead |
D797673, | Mar 25 2014 | FOXCONN INTERCONNECT TECHNOLOGY LIMITED | Electrical connector |
D823262, | May 10 2017 | Xerox Corporation | Earth plate |
D832220, | May 10 2017 | Xerox Corporation | Earth plate |
D865727, | Jun 21 2018 | INNOVELIS, INC | Mount for electronic devices |
D867435, | Jul 04 2018 | INNOVELIS, INC | Mount for electronic devices |
D905067, | May 09 2019 | INNOVELIS, INC | Mount for electronic devices |
D905068, | May 09 2019 | INNOVELIS, INC | Mount for electronic devices |
D905069, | May 09 2019 | INNOVELIS, INC | Mount for electronic devices |
Patent | Priority | Assignee | Title |
3555497, | |||
5342992, | Oct 11 1991 | KYOCERA INTERNATIONAL INC | Pin grid array package with pin through plating |
6465747, | Mar 25 1998 | Tessera, Inc. | Microelectronic assemblies having solder-wettable pads and conductive elements |
20020029902, | |||
20030066681, | |||
186435, | |||
D251781, | May 04 1977 | Blackhawk Industries, Inc. | Electrical wire connector |
D365084, | Aug 10 1994 | SAMSUNG ELECTRONICS CO , LTD | Solder pad for printed circuit boards |
D408353, | Apr 10 1997 | SMK Corporation | Electrical connector terminal |
D409145, | Jul 23 1997 | SMK Corporation | Connector terminal |
D472880, | Jul 23 2001 | Hewlett Packard Enterprise Development LP | Electrical contact |
D475021, | Jul 23 2001 | Hewlett Packard Enterprise Development LP | Electrical contact |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 23 2004 | Neoconix, Inc. | (assignment on the face of the patent) | / | |||
Dec 09 2004 | RADZA, ERIC | NEOCONIX, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016123 | /0596 | |
Sep 27 2013 | NEOCONIX, INC | Silicon Valley Bank | SECURITY AGREEMENT | 031421 | /0568 | |
May 05 2023 | Silicon Valley Bank | NEOCONIX, INC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 063619 | /0209 |
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