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I claim the ornamental design for a radiator for a heat generating components in electronic equipment, as shown and described.
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FIG. 1 is a perspective view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 2 is a front view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 3 is a rear view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 4 is a right side view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 5 is a left side view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 6 is a top plan view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 7 is a bottom plan view of a radiator for heat generating components in electronic equipment according to the present invention; and,
FIG. 8 is an exploded perspective view for illustrating the use of the radiator wherein the environment in which the radiator is associated, including a bracket, a fan, and a surface of a CPU, is shown in broken lines.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Patent | Priority | Assignee | Title |
7583503, | Nov 20 2007 | Asia Vital Components Co., Ltd. | Thermal module allowing adjustment in the height of heat sink relative to fixing rack |
D540750, | Nov 23 2004 | Zalman Tech Co., Ltd. | Radiator for a chipset of a graphic card |
D541230, | Nov 23 2004 | Zalman Tech Co., Ltd. | Radiator for a chipset of a graphic card |
D541756, | Sep 20 2004 | Zalman Tech Co., Ltd. | Radiator for a chipset of a graphic card |
D579420, | Sep 24 2007 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
D626519, | Aug 24 2009 | ACPA Energy Conversion Devices Co., Ltd. | Heat dissipation module for a streetlamp |
Patent | Priority | Assignee | Title |
4103192, | Jun 14 1976 | CHEMICAL BANK, AS COLLATERAL AGENT | Heat dissipating motor mounting arrangement |
4715438, | Jun 30 1986 | Unisys Corporation | Staggered radial-fin heat sink device for integrated circuit package |
6330908, | Mar 15 2000 | Foxconn Precision Components Co., Ltd. | Heat sink |
6336499, | May 31 2001 | CPU heat sink mounting structure | |
6386274, | Jun 28 2001 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
6386275, | Aug 16 2001 | Chaun-Choung Technology Corp. | Surrounding type fin-retaining structure of heat radiator |
6439298, | Apr 17 2001 | Jaffe Limited | Cylindrical heat radiator |
D428857, | Sep 03 1999 | AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD ; AVAGO TECHNOLOGIES GENERAL IP PTE LTD | Cooling device |
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Apr 12 2002 | LEE, SANG-CHEOL | ZALMAN TECH CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013454 | /0362 | |
May 01 2002 | Zalman Tech Co., Ltd. | (assignment on the face of the patent) | / |
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