Patent
   D477291
Priority
Nov 05 2001
Filed
May 01 2002
Issued
Jul 15 2003
Expiry
Jul 15 2017
Assg.orig
Entity
unknown
6
8
n/a
I claim the ornamental design for a radiator for a heat generating components in electronic equipment, as shown and described.

FIG. 1 is a perspective view of a radiator for heat generating components in electronic equipment according to the present invention.

FIG. 2 is a front view of a radiator for heat generating components in electronic equipment according to the present invention.

FIG. 3 is a rear view of a radiator for heat generating components in electronic equipment according to the present invention.

FIG. 4 is a right side view of a radiator for heat generating components in electronic equipment according to the present invention.

FIG. 5 is a left side view of a radiator for heat generating components in electronic equipment according to the present invention.

FIG. 6 is a top plan view of a radiator for heat generating components in electronic equipment according to the present invention.

FIG. 7 is a bottom plan view of a radiator for heat generating components in electronic equipment according to the present invention; and,

FIG. 8 is an exploded perspective view for illustrating the use of the radiator wherein the environment in which the radiator is associated, including a bracket, a fan, and a surface of a CPU, is shown in broken lines.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Lee, Sang-Cheol

Patent Priority Assignee Title
7583503, Nov 20 2007 Asia Vital Components Co., Ltd. Thermal module allowing adjustment in the height of heat sink relative to fixing rack
D540750, Nov 23 2004 Zalman Tech Co., Ltd. Radiator for a chipset of a graphic card
D541230, Nov 23 2004 Zalman Tech Co., Ltd. Radiator for a chipset of a graphic card
D541756, Sep 20 2004 Zalman Tech Co., Ltd. Radiator for a chipset of a graphic card
D579420, Sep 24 2007 Hon Hai Precision Industry Co., Ltd. Heat sink
D626519, Aug 24 2009 ACPA Energy Conversion Devices Co., Ltd. Heat dissipation module for a streetlamp
Patent Priority Assignee Title
4103192, Jun 14 1976 CHEMICAL BANK, AS COLLATERAL AGENT Heat dissipating motor mounting arrangement
4715438, Jun 30 1986 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
6330908, Mar 15 2000 Foxconn Precision Components Co., Ltd. Heat sink
6336499, May 31 2001 CPU heat sink mounting structure
6386274, Jun 28 2001 Foxconn Precision Components Co., Ltd. Heat sink assembly
6386275, Aug 16 2001 Chaun-Choung Technology Corp. Surrounding type fin-retaining structure of heat radiator
6439298, Apr 17 2001 Jaffe Limited Cylindrical heat radiator
D428857, Sep 03 1999 AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD ; AVAGO TECHNOLOGIES GENERAL IP PTE LTD Cooling device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 12 2002LEE, SANG-CHEOLZALMAN TECH CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0134540362 pdf
May 01 2002Zalman Tech Co., Ltd.(assignment on the face of the patent)
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