Patent
   D626519
Priority
Aug 24 2009
Filed
Feb 22 2010
Issued
Nov 02 2010
Expiry
Nov 02 2024
Assg.orig
Entity
unknown
5
8
n/a
The ornamental design for heat dissipation module for streetlamp, as shown and described.

FIG. 1 is a perspective view of a heat dissipation module for streetlamp.

FIG. 2 is a front elevation view thereof.

FIG. 3 is a rear elevation view thereof.

FIG. 4 is a left side elevation view thereof.

FIG. 5 is a right side elevation view thereof.

FIG. 6 is a top plan view thereof.

FIG. 7 is a bottom plan view of heat dissipation module for streetlamp; and,

FIG. 8 is an actual use of state diagram. FIG. 8 is a perspective view thereof in use, wherein the broken lines showing of the environment is for illustrative purposes only and form no part of the claimed design.

Yao, Pei-Chih

Patent Priority Assignee Title
9103540, Apr 21 2011 OptaLite Technologies, Inc. High efficiency LED lighting system with thermal diffusion
D651735, Mar 24 2010 OPTOTRONIC GMBH Luminaire
D651738, Aug 23 2010 RAB LIGHTING, INC Vapor proof LED housing
D673667, Nov 05 2010 Baldor Electric Company Cooling tower fan motor
ER2294,
Patent Priority Assignee Title
6827130, Jun 05 2001 Heat Technology, Inc.; HEAT TECHNOLOGY, INC Heatsink assembly and method of manufacturing the same
7278761, Oct 06 2005 Thermalking Technology International Co. Heat dissipating pole illumination device
7420811, Sep 14 2006 CHAN, TSUNG-WEN Heat sink structure for light-emitting diode based streetlamp
20060250803,
20080089070,
D477291, Nov 05 2001 Zalman Tech Co., Ltd. Radiator for a heat generating components in electronic equipment
D479830, Jul 20 2002 Zalman Tech Co., Ltd. Radiator for heat generating components in electronic equipment
D579420, Sep 24 2007 Hon Hai Precision Industry Co., Ltd. Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 03 2010YAO, PEI-CHIHACPA ENERGY CONVERSION DEVICES SO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0239710660 pdf
Feb 22 2010ACPA Energy Conversion Devices Co., Ltd.(assignment on the face of the patent)
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