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I claim the ornamental design for a heat-conducting block of VGA chipset cooling device, as shown and described in the attached six drawings.
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FIG. 1 is a perspective view of a heat-conducting block of VGA chipset cooling device according to the present invention.
FIG. 2 is a front view of the heat-conducting block according to the present invention; the rear view of the heat-conducting block is a mirror image of FIG. 2.
FIG. 3 is a right side view of the heat-conducting block according to the present invention; the left side view of the heat-conducting block is a mirror image of FIG. 3.
FIG. 4 is a top plan view of the heat-conducting block according to the present invention.
FIG. 5 is a bottom plan view of the heat-conducting block according to the present invention; and,
FIG. 6 is a perspective view illustrating use of the heat-conducting block according to the present invention.
The broken lines in the figures indicate environmental elements for illustrative purposes only and form no part of the claimed design.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Mar 24 2003 | LEE, SANG CHEOL | ZALMAN TECH CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013982 | /0221 | |
| Apr 15 2003 | Zalman Tech Co., Ltd. | (assignment on the face of the patent) | / |
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