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The ornamental design for a heat sink for electronic equipment, as shown and described.
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FIG. 1 is an isometric view of the heat sink for electronic equipment;
FIG. 2 is a left-side elevational view of the heat sink for electronic equipment;
FIG. 3 is a right-side elevational view of the heat sink for electronic equipment;
FIG. 4 is an elevational view of the aft end of the heat sink for electronic equipment;
FIG. 5 is an elevational view of the forward end of the heat sink for electronic equipment; and,
FIG. 6 is a top plan view of the heat sink for electronic equipment.
The bottom of the heat sink forms no part of the claimed design.
Watson, David A., Cook, Alexander, Douglas, David W., Leyshon, Frank A., Speck, Stephen D., O'Sullivan, Michael E.
Patent | Priority | Assignee | Title |
D493151, | Nov 11 2002 | Zalman Tech Co., Ltd. | Heat-conducting block of VGA chipset cooling device |
D499074, | Sep 16 2003 | Vanner, Inc. | Enclosure for electronic equipment |
D627316, | Jan 07 2009 | Graco Minnesota Inc.; Graco Minnesota Inc | Heater board enclosure |
D632266, | Sep 18 2009 | Delta Electronics, Inc. | Heat dissipating module |
D694721, | May 07 2012 | Heatsink | |
D722575, | Jul 12 2013 | Liebherr-Elektronik GmbH | Housing for electronic modules with cooling fins |
D722576, | Jul 12 2013 | Liebherr-Elektronik GmbH | Housing for electronic modules with cooling fins |
D722577, | Jul 12 2013 | Liebherr-Elektronik GmbH | Housing for electronic modules with cooling fins |
D778839, | Jan 08 2015 | GLUX VISUAL EFFECTS TECH (SHENZHEN) CO., LTD; GLUX VISUAL EFFECTS TECH SHENZHEN CO , LTD | LED module |
D873225, | Dec 06 2017 | Omron Corporation | Heatsink |
D877112, | Aug 20 2018 | Yamaha Corporation | Amplifier |
Patent | Priority | Assignee | Title |
3209062, | |||
6206087, | Apr 30 1997 | NIDEC CORPORATION | Heat sink fan |
6341644, | Jul 01 2000 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
6397941, | Dec 01 1999 | TICONA POLYMERS, INC | Net-shape molded heat exchanger |
6487078, | Mar 13 2000 | Legacy Electronics, Inc | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
6515862, | Mar 31 2000 | Intel Corporation | Heat sink assembly for an integrated circuit |
D403666, | Feb 27 1997 | CONGRESS FINANCIAL CORPORATION WESTERN AS AGENT | Heat sink |
D449587, | Feb 28 2001 | CommScope Technologies LLC | Heat sink |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 08 2002 | DOUGLAS, DAVID W | VANNER INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013571 | /0171 | |
Nov 08 2002 | O SULLIVAN, MICHAEL E | VANNER INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013571 | /0171 | |
Nov 08 2002 | SPECK, STEPHEN D | VANNER INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013571 | /0171 | |
Nov 08 2002 | COOK, ALEXANDER | VANNER INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013571 | /0171 | |
Nov 12 2002 | WATSON, DAVID A | VANNER INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013571 | /0171 | |
Nov 12 2002 | LEYSHON, FRANK A | VANNER INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013571 | /0171 | |
Dec 10 2002 | Vanner, Inc. | (assignment on the face of the patent) | / | |||
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