Patent
   D722577
Priority
Jul 12 2013
Filed
Jan 09 2014
Issued
Feb 17 2015
Expiry
Feb 17 2029
Assg.orig
Entity
unknown
7
16
n/a
The ornamental design for a housing for electronic modules with cooling fins, as shown and described.

FIG. 1 is a front view of a design for a housing for electronic modules with cooling fins according to the present disclosure.

FIG. 2 is a back view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 3 is a left view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 4 is a right view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 5 is a top view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 6 is a bottom view of the housing for electronic modules with cooling fins of FIG. 1; and,

FIG. 7 is a perspective view of the housing for electronic modules with cooling fins of FIG. 1.

The solid lines in FIGS. 1-7 illustrate a housing for electronic modules with cooling fins according to the present disclosure. The broken lines form no part of the claimed design.

Zimmer, Martin

Patent Priority Assignee Title
D821446, Aug 31 2016 Sevcon Limited Electric motor controller
D831073, Aug 31 2016 Sevcon Limited Electric motor controller
D848960, Nov 10 2017 AURAS TECHNOLOGY CO., LTD. Water cooling radiator
D848961, Feb 06 2018 AURAS TECHNOLOGY CO., LTD. Water cooling device
D848962, Feb 06 2018 AURAS TECHNOLOGY CO., LTD. Water cooling device
D850487, Aug 31 2016 CSL2 LIMITED; TURNTIDE DRIVES LIMITED Electric motor controller
D927438, Sep 09 2019 Thales Alenia Space France Housing for electronic modules
Patent Priority Assignee Title
3592260,
6144092, Feb 02 1998 DELPHI TECHNOLOGIES IP LIMITED Electronic power device heatsink clamping system
6313399, Nov 21 1997 Muuntolaite Oy Cooling element for an unevenly distributed heat load
6326761, Mar 25 1999 ZF Friedrichshafen AG Power electronics device for controlling an electric machine
6421239, Jun 06 2000 Chaun-Choung Technology Corp. Integral heat dissipating device
6671177, Oct 25 2002 EVGA COM CORPORATION Graphics card apparatus with improved heat dissipation
6778390, May 15 2001 Nvidia Corporation High-performance heat sink for printed circuit boards
6847525, May 24 2002 Unisys Corporation Forced convection heat sink system with fluid vector control
20080291632,
20110051370,
20120103589,
D368253, Jul 19 1993 CONGRESS FINANCIAL CORPORATION WESTERN AS AGENT Heat sink
D403666, Feb 27 1997 CONGRESS FINANCIAL CORPORATION WESTERN AS AGENT Heat sink
D449587, Feb 28 2001 CommScope Technologies LLC Heat sink
D483019, Dec 10 2002 Vanner, Inc. Heat sink for electronic equipment
D627316, Jan 07 2009 Graco Minnesota Inc.; Graco Minnesota Inc Heater board enclosure
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 09 2014Liebherr-Elektronik GmbH(assignment on the face of the patent)
Jan 15 2014ZIMMER, MARTINLiebherr-Elektronik GmbHASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0329530199 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule