Patent
   D403666
Priority
Feb 27 1997
Filed
Apr 01 1998
Issued
Jan 05 1999
Expiry
Jan 05 2013
Assg.orig
Entity
unknown
16
4
n/a
The ornamental design for heat sink, as shown and described.

FIG. 1 is a perspective view of the heat sink embodying the new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a front elevational view thereof; and,

FIG. 5 is a right side elevational view thereof, the left side being a mirror image thereof.

The bottom of the heat sink forms no part of the claimed design. The broken line showing of supports in FIGS. 3-5 is for illustrative purposes only and forms no part of the claimed design.

Mays, J. Carroll, Maack, Timothy R., Serpell-Morris, David, Wake, Bob Duane

Patent Priority Assignee Title
D449587, Feb 28 2001 CommScope Technologies LLC Heat sink
D479828, Dec 09 2002 HANGER SOLUTIONS, LLC Inside-out heat sink
D479829, Dec 09 2002 HANGER SOLUTIONS, LLC Inside-out heat sink
D480696, Aug 09 2002 MOTOROLA SOLUTIONS, INC Mobile radio housing
D483019, Dec 10 2002 Vanner, Inc. Heat sink for electronic equipment
D490382, Dec 09 2002 HANGER SOLUTIONS, LLC Inside-out heat sink
D499074, Sep 16 2003 Vanner, Inc. Enclosure for electronic equipment
D604255, Oct 23 2008 ABL IP Holding LLC Heat sink
D613257, Oct 23 2008 ABL IP Holding LLC Heat sink
D722575, Jul 12 2013 Liebherr-Elektronik GmbH Housing for electronic modules with cooling fins
D722576, Jul 12 2013 Liebherr-Elektronik GmbH Housing for electronic modules with cooling fins
D722577, Jul 12 2013 Liebherr-Elektronik GmbH Housing for electronic modules with cooling fins
D815605, Feb 29 2016 Omron Corporation Solid state relay
D853369, Jan 18 2017 Samsung Electronics Co., Ltd. Repeater for communications apparatus
D873225, Dec 06 2017 Omron Corporation Heatsink
D960148, Nov 05 2018 AT-DESIGN GBR; Siemens Aktiengesellschaft Computer
Patent Priority Assignee Title
5335722, Sep 30 1993 Global Win Technology Co., Ltd; Huei Bin Enterprise Corp. Cooling assembly for an integrated circuit
5504652, Sep 16 1994 Apple Computer, Inc. Unitary heat sink for integrated circuits
D260513, Mar 15 1979 Housing for electrical circuits
D368253, Jul 19 1993 CONGRESS FINANCIAL CORPORATION WESTERN AS AGENT Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 01 1998Rockford Corporation(assignment on the face of the patent)
Jun 28 2001Rockford CorporationBANK OF AMERICA, N A , AS COLLATERAL AGENTNOTICE OF GRANT OF SECURITY INTEREST0124630470 pdf
Mar 29 2004ROCKFORD CORPORATION, AN ARIZONA CORPORATIONCONGRESS FINANCIAL CORPORATION WESTERN AS AGENTASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0152230663 pdf
Mar 30 2004BANK OF AMERICA, N A , AS COLLATERAL AGENTRockford CorporationTERMINATION OF SECURITY INTEREST IN PATENTS0152230696 pdf
Nov 16 2012Rockford CorporationWells Fargo Bank, National AssociationSECURITY AGREEMENT0293110265 pdf
Sep 29 2021WELLS FARGO BANK, N A Rockford CorporationRELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS 0601350805 pdf
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