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I claim the ornamental design for an inside-out heat sink, as shown and described.
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FIG. 1 is a perspective view illustrating the top, front and right side of a design for the inside out heat sink;
FIG. 2 is a top plan view thereof;
FIG. 3 is right side elevational view thereof, with the opposite side being a mirror image;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof; and,
FIG. 6 is a bottom plan view thereof.
Patent | Priority | Assignee | Title |
11859915, | Jan 31 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
D543953, | Sep 02 2003 | MIND FUSION, LLC | Wing portion of a butterfly-style inside-out heat sink |
D822625, | Apr 26 2016 | Resonac Corporation | Fin for heat exchanger |
D856944, | Jan 31 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
D856945, | Jan 31 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
D896767, | Dec 02 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
D912061, | Jun 03 2019 | Apple Inc | Lattice |
D969760, | Dec 02 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
D983793, | Aug 01 2022 | Shenzhen Maidemailuo Technology Co., Ltd. | Installation frame for screen protector |
Patent | Priority | Assignee | Title |
4546405, | May 25 1983 | International Business Machines Corporation | Heat sink for electronic package |
4942497, | Jul 24 1987 | NEC Corporation | Cooling structure for heat generating electronic components mounted on a substrate |
5113315, | Aug 07 1990 | Cirqon Technologies Corporation | Heat-conductive metal ceramic composite material panel system for improved heat dissipation |
5653285, | Mar 31 1993 | Heat sink apparatus | |
6244331, | Oct 22 1999 | Intel Corporation | Heatsink with integrated blower for improved heat transfer |
D341820, | Mar 04 1992 | Itoh Research & Development Laboratory Co., Ltd. | Heat dissipating device for a semiconductor package |
D403666, | Feb 27 1997 | CONGRESS FINANCIAL CORPORATION WESTERN AS AGENT | Heat sink |
D449587, | Feb 28 2001 | CommScope Technologies LLC | Heat sink |
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Nov 27 2002 | DUGAS, ROGER | XANOPTIX, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013564 | /0355 | |
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Oct 19 2004 | XANOPTIX, INC | XAN3D TECHNOLOGIES, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 021242 | /0414 | |
Aug 16 2005 | XAN3D TECHNOLOGIES, INC | CUBIC WAFER, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 021304 | /0731 | |
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Nov 26 2019 | CUFER ASSET LTD L L C | INTELLECTUAL VENTURES ASSETS 161 LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 051873 | /0365 | |
Dec 06 2019 | INTELLECTUAL VENTURES ASSETS 161 LLC | HANGER SOLUTIONS, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052159 | /0509 |
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