Patent
   D490382
Priority
Dec 09 2002
Filed
Dec 09 2002
Issued
May 25 2004
Expiry
May 25 2018
Assg.orig
Entity
unknown
9
8
n/a
I claim the ornamental design for an inside-out heat sink, as shown and described.

FIG. 1 is a perspective view illustrating the top, front and right side of a design for the inside out heat sink;

FIG. 2 is a top plan view thereof;

FIG. 3 is right side elevational view thereof, with the opposite side being a mirror image;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a bottom plan view thereof.

Dugas, Roger

Patent Priority Assignee Title
11859915, Jan 31 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D543953, Sep 02 2003 MIND FUSION, LLC Wing portion of a butterfly-style inside-out heat sink
D822625, Apr 26 2016 Resonac Corporation Fin for heat exchanger
D856944, Jan 31 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D856945, Jan 31 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D896767, Dec 02 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D912061, Jun 03 2019 Apple Inc Lattice
D969760, Dec 02 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D983793, Aug 01 2022 Shenzhen Maidemailuo Technology Co., Ltd. Installation frame for screen protector
Patent Priority Assignee Title
4546405, May 25 1983 International Business Machines Corporation Heat sink for electronic package
4942497, Jul 24 1987 NEC Corporation Cooling structure for heat generating electronic components mounted on a substrate
5113315, Aug 07 1990 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation
5653285, Mar 31 1993 Heat sink apparatus
6244331, Oct 22 1999 Intel Corporation Heatsink with integrated blower for improved heat transfer
D341820, Mar 04 1992 Itoh Research & Development Laboratory Co., Ltd. Heat dissipating device for a semiconductor package
D403666, Feb 27 1997 CONGRESS FINANCIAL CORPORATION WESTERN AS AGENT Heat sink
D449587, Feb 28 2001 CommScope Technologies LLC Heat sink
///////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 27 2002DUGAS, ROGERXANOPTIX, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135640355 pdf
Dec 09 2002Xanoptix, Inc.(assignment on the face of the patent)
Oct 19 2004XANOPTIX, INC XAN3D TECHNOLOGIES, INC CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0212420414 pdf
Aug 16 2005XAN3D TECHNOLOGIES, INC CUBIC WAFER, INC CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0213040731 pdf
Mar 21 2008CUBIC WAFER, INC CUFER ASSET LTD L L C ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0211730157 pdf
Nov 26 2019CUFER ASSET LTD L L C INTELLECTUAL VENTURES ASSETS 161 LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0518730365 pdf
Dec 06 2019INTELLECTUAL VENTURES ASSETS 161 LLCHANGER SOLUTIONS, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0521590509 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule