Patent
   D543953
Priority
Sep 02 2003
Filed
Sep 02 2003
Issued
Jun 05 2007
Expiry
Jun 05 2021
Assg.orig
Entity
unknown
11
19
n/a
We claim the ornamental design for a wing portion of a butterfly-style inside out heat sink, as shown and described.

FIG. 1 is a perspective view illustrating the top, front and right side of a butterfly-style, inside out heat sink wing portion embodying our claimed design, wherein the broken-line disclosure illustrates an example intended environment of this example embodiment for illustrative purposes only and forms no part of the claimed design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof, with the opposite side being a mirror image;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a bottom plan view thereof.

Dugas, Roger, Frushour, Ross L.

Patent Priority Assignee Title
11859915, Jan 31 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D605141, Oct 17 2008 Passive heat sink stand for electronic devices
D662897, Jan 04 2011 TECHNICOLOR S A Heat sink
D776801, Jun 24 2014 Kobe Steel, Ltd Heat exchanger tube
D814625, Apr 25 2016 NeoGraf Solutions, LLC Heat spreader
D814626, Apr 25 2016 NeoGraf Solutions, LLC Heat spreader
D814627, Apr 25 2016 NeoGraf Solutions, LLC Heat spreader
D856944, Jan 31 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D856945, Jan 31 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D896767, Dec 02 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D969760, Dec 02 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
Patent Priority Assignee Title
3971435, Jul 13 1971 NCR Corporation Heat transfer device
4283464, May 08 1979 SEMI-ALLOYS INC Prefabricated composite metallic heat-transmitting plate unit
4620216, Apr 29 1983 International Business Machines Corporation Unitary slotted heat sink for semiconductor packages
4897712, Feb 07 1987 Suddeutsche Kuhlerfabrik Julius Fr. Behr GmbH & Co. KG Heat sink, particulary for the cooling of electronic elements
4926242, Oct 03 1984 Sumitomo Electric Industries, Ltd. Aluminum-silicon alloy heatsink for semiconductor devices
4942497, Jul 24 1987 NEC Corporation Cooling structure for heat generating electronic components mounted on a substrate
5213153, Mar 20 1991 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
5653891, Jun 03 1992 Seiko Epson Corporation Method of producing a semiconductor device with a heat sink
5988266, Oct 29 1997 Eastman Kodak Company Bonded cast, pin-finned heat sink and method of manufacture
6196302, Mar 16 1999 Heat sink with multi-layer dispersion space
6367543, Dec 11 2000 Thermal Corp. Liquid-cooled heat sink with thermal jacket
6501652, Feb 24 1997 Fujitsu Limited Heat sink and information processor using it
6503626, Feb 25 2000 UCAR GRAPH-TECH INC Graphite-based heat sink
20030205369,
20040108101,
D479828, Dec 09 2002 HANGER SOLUTIONS, LLC Inside-out heat sink
D479829, Dec 09 2002 HANGER SOLUTIONS, LLC Inside-out heat sink
D490382, Dec 09 2002 HANGER SOLUTIONS, LLC Inside-out heat sink
JP6310629,
/////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 27 2003DUGAS, ROGERXANOPTIX, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0144850005 pdf
Aug 27 2003FRUSHOUR, ROSS L XANOPTIX, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0144850005 pdf
Sep 02 2003Cubic Wafer, Inc.(assignment on the face of the patent)
Oct 19 2004XANOPTIX, INC CUBIC WAFER, INC CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0186580840 pdf
Mar 21 2008CUBIC WAFER, INC CUFER ASSET LTD L L C ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0211730200 pdf
Dec 22 2022CUFER ASSET LTD L L C INTELLECTUAL VENTURES ASSETS 191 LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0626660371 pdf
Feb 14 2023MIND FUSION, LLCINTELLECTUAL VENTURES ASSETS 191 LLCSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0632950001 pdf
Feb 14 2023MIND FUSION, LLCINTELLECTUAL VENTURES ASSETS 186 LLCSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0632950001 pdf
Feb 14 2023INTELLECTUAL VENTURES ASSETS 191 LLCMIND FUSION, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0642700685 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule