The ornamental design for a housing for electronicmodules with cooling fins, as shown and described.
FIG. 1 is a front view of a design for a housing for electronic modules with cooling fins according to the present disclosure.
FIG. 2 is a back view of the housing for electronic modules with cooling fins of FIG. 1.
FIG. 3 is a left view of the housing for electronic modules with cooling fins of FIG. 1.
FIG. 4 is a right view of the housing for electronic modules with cooling fins of FIG. 1.
FIG. 5 is a top view of the housing for electronic modules with cooling fins of FIG. 1.
FIG. 6 is a bottom view of the housing for electronic modules with cooling fins of FIG. 1; and,
FIG. 7 is a perspective view of the housing for electronic modules with cooling fins of FIG. 1.
The solid lines in FIGS. 1-7 illustrate a housing for electronic modules with cooling fins according to the present disclosure. The broken lines form no part of the claimed design.