Patent
   D722575
Priority
Jul 12 2013
Filed
Jan 09 2014
Issued
Feb 17 2015
Expiry
Feb 17 2029
Assg.orig
Entity
unknown
1
16
n/a
The ornamental design for a housing for electronic modules with cooling fins, as shown and described.

FIG. 1 is a front view of a design for a housing for electronic modules with cooling fins according to the present disclosure.

FIG. 2 is a back view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 3 is a left view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 4 is a right view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 5 is a top view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 6 is a bottom view of the housing for electronic modules with cooling fins of FIG. 1; and,

FIG. 7 is a perspective view of the housing for electronic modules with cooling fins of FIG. 1.

The solid lines in FIGS. 1-7 illustrate a housing for electronic modules with cooling fins according to the present disclosure. The broken lines form no part of the claimed design.

Zimmer, Martin

Patent Priority Assignee Title
D965541, Jan 19 2022 Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 09 2014Liebherr-Elektronik GmbH(assignment on the face of the patent)
Jan 15 2014ZIMMER, MARTINLiebherr-Elektronik GmbHASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0329530207 pdf
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