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Patent
D965541
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Priority
Jan 19 2022
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Filed
Jan 19 2022
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Issued
Oct 04 2022
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Expiry
Oct 04 2037
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Assg.orig
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Entity
unknown
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0
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11
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 is a perspective view of a heat sink showing my new design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
Wang, Yizhou
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
20180173281, |
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20190109069, |
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20190383566, |
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D281969, |
Feb 04 1983 |
DANFOS A S |
Casing for electrical apparatus or the like |
D464939, |
Dec 26 2001 |
Thermal Integration Technology Inc. |
Heat sink |
D613258, |
May 15 2009 |
PHILIPS LIGHTING HOLDING B V |
Heatsink |
D638376, |
Aug 06 2010 |
Cisco Technology, Inc.; Cisco Technology, Inc |
Passive cooling element |
D722575, |
Jul 12 2013 |
Liebherr-Elektronik GmbH |
Housing for electronic modules with cooling fins |
D892753, |
Oct 31 2018 |
BITMAIN TECHNOLOGIES INC. |
Heat sink |
D904323, |
Jan 17 2019 |
Telefonaktiebolaget LM Ericsson (publ) |
Heat sink |
D924186, |
Mar 09 2020 |
CAMBRICON TECHNOLOGIES CORPORATION LIMITED |
Board card |
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