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Patent
D632266
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Priority
Sep 18 2009
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Filed
Sep 18 2009
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Issued
Feb 08 2011
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Expiry
Feb 08 2025
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Assg.orig
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Entity
unknown
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1
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12
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n/a
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The ornamental design for a heat dissipating module, as shown and described herein.
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FIG. 1 is a top, front perspective view from the front and left side of a heat dissipating module showing our new design:
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plane view thereof; and,
FIG. 7 is a bottom plane view thereof.
Huang, Yu-Hung, Hung, Chun-Yang, Kuo, Kun-Yu
Patent |
Priority |
Assignee |
Title |
6151214, |
May 26 1999 |
FIRST INTERNATIONAL COMPUTER, INC |
Bearing structure of a central processing unit |
7277280, |
Nov 25 2005 |
FU ZHUN PRECISION INDUSTRY SHENZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Heat dissipation device having a dual-fan arrangement |
7382618, |
Oct 13 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Heat dissipating apparatus for computer add-on cards |
7492588, |
Apr 06 2007 |
FURUI PRECISE COMPONENT KUNSHAN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Heat dissipation apparatus with porous type heat dissipater |
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20080011454, |
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20090135563, |
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20090147476, |
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20090168352, |
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20090321058, |
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D483019, |
Dec 10 2002 |
Vanner, Inc. |
Heat sink for electronic equipment |
D597497, |
Oct 26 2007 |
Delta Electronics Inc. |
Heat dissipating module |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a