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Patent
D597497
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Priority
Oct 26 2007
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Filed
Nov 15 2007
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Issued
Aug 04 2009
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Expiry
Aug 04 2023
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Assg.orig
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Entity
unknown
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5
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6
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n/a
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The ornamental design for a heat dissipating module, as shown and described herein.
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FIG. 1 is a perspective view of a heat dissipating module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear eleavational view thereof;
FIG. 4 is a left side elevational view thereof; and
FIG. 5 is a right side elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Huang, Yu-Hung, Hung, Chun-Yang, Ho, Sung-Ching, Chen, Chin-Ming
Patent |
Priority |
Assignee |
Title |
6446708, |
Oct 17 2001 |
Tai-Sol Electronics Co., Ltd. |
Heat dissipating device |
6607028, |
Jul 29 2002 |
Waffer Technology Corp.; Jack, Wang |
Positioning structure for heat dissipating fins |
20060219392, |
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20060225866, |
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D266082, |
Mar 30 1980 |
Showa Aluminum Kabushiki Kaisha |
Heat releasing plate for mounting semiconductor components |
D467559, |
Feb 23 2001 |
Zalman Tech Co., Ltd., |
Radiator for heat generating components in electronic equipment |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a