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The ornamental design for a heat dissipation device, as shown and described.
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FIG. 1 is a perspective view of a heat dissipation device of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a perspective view thereof being mounted to a VGA card which is shown in broken lines for illustrative purposes only and forms no part of the claimed design.
Lee, Hsieh-Kun, Peng, Xue-Wen, Chen, Rui-Hua
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jun 15 2004 | LEE, HSIEH-KUN | HON HAI PRECISION INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015593 | /0667 | |
| Jun 15 2004 | PENG, XUE-WEN | HON HAI PRECISION INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015593 | /0667 | |
| Jun 15 2004 | CHEN, RUI-HUA | HON HAI PRECISION INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015593 | /0667 | |
| Jul 16 2004 | Hon Hai Precision Industry Co., Ltd. | (assignment on the face of the patent) | / |
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