Patent
   D722573
Priority
Nov 26 2013
Filed
Nov 26 2013
Issued
Feb 17 2015
Expiry
Feb 17 2029
Assg.orig
Entity
unknown
3
8
n/a
The ornamental design for a U-shaped condenser heat sink for low profile modules, as shown and described.

FIG. 1 is a top perspective view of a U-shaped condenser heat sink for low profile modules showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a left side elevational view thereof;

FIG. 8 is a right side elevational view thereof;

FIG. 9 is a top perspective view of one U-shaped condenser heat sink for low profile modules connected with a generic circuit board, another near and unconnected from a generic circuit board and showing two modules that are to be received by each of the U-shaped condenser heat sink for low profile modules; and,

FIG. 10 shows the assembly of FIG. 9 when assembled for integration, showing one module fully received and another module partially received by the U-shaped condenser heat sink for low profile modules.

The generic circuit boards and the modules shown FIGS. 9-10 form no part of the claimed design.

The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.

Mira, Ali, Mira, Yashar, Mira, Michael

Patent Priority Assignee Title
D905647, Jul 20 2018 HEATSCAPE COM, INC Combination heat pipe and heat sink
D954005, Sep 12 2019 FURUKAWA ELECTRIC CO ; FURUKAWA ELECTRIC CO , LTD Heatsink
D971862, Dec 28 2018 FURUKAWA ELECTRIC CO , LTD Heatsink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 26 2013MIRA, ALIHEATSCAPE, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316830116 pdf
Sep 26 2013MIRA, MICHAELHEATSCAPE, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316830116 pdf
Sep 26 2013MIRA, YASHARHEATSCAPE, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316830116 pdf
Nov 26 2013Heatscape, Inc.(assignment on the face of the patent)
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