The ornamental design for a U-shaped condenser heat sink for low profile modules, as shown and described.
FIG. 1 is a top perspective view of a U-shaped condenser heat sink for low profile modules showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevational view thereof;
FIG. 8 is a right side elevational view thereof;
FIG. 9 is a top perspective view of one U-shaped condenser heat sink for low profile modules connected with a generic circuit board, another near and unconnected from a generic circuit board and showing two modules that are to be received by each of the U-shaped condenser heat sink for low profile modules; and,
FIG. 10 shows the assembly of FIG. 9 when assembled for integration, showing one module fully received and another module partially received by the U-shaped condenser heat sink for low profile modules.
The generic circuit boards and the modules shown FIGS. 9-10 form no part of the claimed design.
The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.