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The ornamental design for a wire solder applicator, as shown and described.
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FIG. 1 is a perspective view of a wire solder applicator showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a left side view thereof; and,
FIG. 6 is a right side view thereof.
Yanagawa, Yoshiaki, Ishii, Kou
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 09 2004 | ISHII, KOU | Pentel Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015613 | /0963 | |
Jul 09 2004 | YANAGAWA, YOSHIAKI | Pentel Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015613 | /0963 | |
Jul 09 2004 | ISHII, KOU | SENJU METAL INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015613 | /0963 | |
Jul 09 2004 | YANAGAWA, YOSHIAKI | SENJU METAL INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015613 | /0963 | |
Jul 21 2004 | Pentel Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
Jul 21 2004 | Senju Metal Industry Co., Ltd. | (assignment on the face of the patent) | / |
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