Patent
   D771168
Priority
Oct 31 2014
Filed
Oct 31 2014
Issued
Nov 08 2016
Expiry
Nov 08 2030
Assg.orig
Entity
unknown
3
55
n/a
The ornamental design for a wire bonding ceramic capillary, as shown and described.

FIG. 1 depicts a first perspective view of a wire bonding ceramic capillary.

FIG. 2 depicts a second perspective view thereof;

FIG. 3 depicts a top plan view thereof;

FIG. 4 depicts a side elevation view thereof; and,

FIG. 5 depicts a bottom plan view thereof.

The broken lines in the drawings illustrate environmental structure on the article and form no part of the claimed design.

Bell, Russell

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D868123, Dec 20 2016 CoorsTek, Inc. Wire bonding wedge tool
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 31 2014CoorsTek, Inc.(assignment on the face of the patent)
Nov 14 2014BELL, RUSSELLCOORSTEK, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0341900658 pdf
Aug 29 2019COORSTEK, INC WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENTSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0502370557 pdf
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