FIG. 1 depicts a perspective view of a wire bonding wedge tool.
FIG. 2 depicts a second perspective view of the wire bonding wedge tool of FIG. 1, wherein FIG. 2 is rotated axially 90 degrees relative to FIG. 1.
FIG. 3 depicts a front side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 4 depicts a right side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 5 depicts a left side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 6 depicts a rear side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 7 depicts a top plan view of the wire bonding wedge tool of FIG. 6; and,
FIG. 8 depicts a bottom plan view of the wire bonding wedge tool of FIG. 6.
The broken lines in the figures depict portions of the wire bonding wedge tool that form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
11697945, |
Oct 22 2016 |
Masterspas, LLC |
Filter assembly having an outer filter element and an inner filter element removably installed within the outer filter element |
11813638, |
Jun 16 2017 |
NINGBO WEILDER ELECTRIC APPLIANCE CO , LTD |
Heating device for hot melt glue gun |
D771168, |
Oct 31 2014 |
COORSTEK, INC |
Wire bonding ceramic capillary |
D779566, |
Oct 02 2015 |
PEARSON ENGINEERIING LIMITED |
Plowing tine replacement section |
D797171, |
Feb 03 2015 |
COORSTEK, INC |
Ceramic bonding tool with textured tip |
D797172, |
Feb 03 2015 |
COORSTEK, INC |
Ceramic bonding tool with textured tip |
D797826, |
Feb 03 2015 |
COORSTEK, INC |
Ceramic bonding tool with textured tip |
D815168, |
May 23 2017 |
RPM INDUSTRIAL COATINGS GROUP, INC |
Cartridge for heat pump dispenser |
D821468, |
Feb 03 2015 |
CoorsTek, Inc. |
Ceramic bonding tool with textured tip |
D824969, |
Feb 03 2015 |
CoorsTek, Inc. |
Ceramic bonding tool with textured tip |
D824970, |
Feb 03 2015 |
CoorsTek, Inc. |
Ceramic bonding tool with textured tip |
D855755, |
Oct 22 2016 |
Master Spas, Inc. |
Filter |
D868123, |
Dec 20 2016 |
CoorsTek, Inc. |
Wire bonding wedge tool |
D880656, |
Oct 22 2016 |
Master Spas, Inc. |
Inner filter element |
D916238, |
Oct 22 2016 |
Masterspas, LLC |
Outer filter element |
Patent |
Priority |
Assignee |
Title |
3690538, |
|
|
|
4030657, |
Dec 26 1972 |
RCA Corporation |
Wire lead bonding tool |
4415115, |
Jun 08 1981 |
Motorola, Inc. |
Bonding means and method |
4600138, |
Jul 25 1984 |
PALOMAR TECHNOLOGIES, INC |
Bonding tool and clamp assembly and wire handling method |
5217154, |
Jun 13 1989 |
Small Precision Tools, Inc. |
Semiconductor bonding tool |
5248076, |
Aug 22 1989 |
Cooper Brands, Inc |
Soldering tool |
5445306, |
May 31 1994 |
Motorola, Inc. |
Wedge wire bonding tool tip |
5485949, |
Apr 30 1993 |
MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD 1006, OHAZA KADOMA |
Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary |
5683603, |
Apr 19 1995 |
|
Electric soldering iron tip improvements |
5954260, |
Dec 16 1997 |
Texas Instruments Incorporated |
Fine pitch bonding technique |
6041995, |
Mar 06 1997 |
Kabushiki Kaisha Shinkawa |
Wire bonding method |
6068174, |
Dec 13 1996 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
6158647, |
Sep 29 1998 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Concave face wire bond capillary |
6260753, |
Aug 07 1998 |
STMICROELECTRONICS S R L |
Gold bumps bonding on connection pads and subsequent coining of their vertex |
6352197, |
Jan 29 1999 |
Rohm Co., Ltd. |
Method and apparatus for wire-bonding for electric components |
6564989, |
Aug 22 2000 |
Renesas Electronics Corporation |
Wire bonding method and wire bonding apparatus |
6646228, |
Aug 18 1999 |
Hyperion Innovations, Inc.; HYPERION INNOVATIONS, INC |
Cordless soldering iron |
7051915, |
Aug 29 2002 |
Rohm Co., Ltd. |
Capillary for wire bonding and method of wire bonding using it |
7216794, |
Jun 09 2005 |
Texas Instruments Incorporated |
Bond capillary design for ribbon wire bonding |
7247588, |
Nov 22 2002 |
SAINT-GOBALN CERAMICS & PLASTICS, INC |
Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same |
7249702, |
Dec 04 2003 |
KULICKE AND SOFFA INDUSTRIES, INC |
Multi-part capillary |
7407080, |
Apr 02 2004 |
STATS CHIPPAC PTE LTE |
Wire bond capillary tip |
7918378, |
Aug 06 2010 |
National Semiconductor Corporation |
Wire bonding deflector for a wire bonder |
8056794, |
Oct 09 2006 |
Kulicke and Soffa Industries, Inc. |
Combination wedge bonding and ball bonding transducer |
8292160, |
Feb 23 2009 |
Shinkawa Ltd |
Method of manufacturing semiconductor device, and bonding apparatus |
213782, |
|
|
|
D271741, |
Feb 02 1981 |
RUBBERMAID OFFICE PRODUCTS INC |
Soldering iron tip |
D431434, |
Jan 08 1998 |
Hakko Corporation |
Soldering iron tip |
D549255, |
Nov 08 2004 |
HYPERION INNOVATIONS, INC |
Soldering iron tip |
D598721, |
Apr 24 2008 |
|
Motorcycle maintenance tool |
JP200368784, |
|
|
|
JP200487822, |
|
|
|
JP2009147103, |
|
|
|
JP2013135008, |
|
|
|
TW201412448, |
|
|
|
TW201429600, |
|
|
|
TW201429601, |
|
|
|