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The ornamental design for a headset body for a communications headset, as shown and described.
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FIG. 1 is a lower front left perspective view of a headset body for a communications headset, the broken line drawing of an illustrative earloop is for illustrative purposes only and form no part of the claimed design.
FIG. 2 is a lower front right perspective view of the headset body.
FIG. 3 is a bottom plan view of the headset body.
FIG. 4 is a top plan view of the headset body.
FIG. 5 is a front elevational view of the headset body.
FIG. 6 is a rear elevational view of the headset body.
FIG. 7 is a right side elevational view of the headset body; and,
FIG. 8 is a left side elevational view of the headset body.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Mar 07 2005 | YANG, JOSEPH W | Plantronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016383 | /0909 | |
| Mar 09 2005 | Plantronics, Inc. | (assignment on the face of the patent) | / | |||
| Jul 02 2018 | Plantronics, Inc | Wells Fargo Bank, National Association | SECURITY AGREEMENT | 046491 | /0915 | |
| Jul 02 2018 | Polycom, Inc | Wells Fargo Bank, National Association | SECURITY AGREEMENT | 046491 | /0915 | |
| Aug 29 2022 | Wells Fargo Bank, National Association | Plantronics, Inc | RELEASE OF PATENT SECURITY INTERESTS | 061356 | /0366 | |
| Aug 29 2022 | Wells Fargo Bank, National Association | Polycom, Inc | RELEASE OF PATENT SECURITY INTERESTS | 061356 | /0366 |
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