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The ornamental design for headset, as shown.
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FIG. 1 is a front perspective view of a headset showing our new design;
FIG. 2 is a front elevational view of the ornamental design of the present invention;
FIG. 3 is a rear elevational view of the ornamental design of the present invention;
FIG. 4 is a left side elevational view of the ornamental design of the present invention;
FIG. 5 is a right side elevational view of the ornamental design of the present invention;
FIG. 6 is a top plan view of the ornamental design of the present invention; and,
FIG. 7 is a bottom view of the ornamental design of the present invention.
Hwang, Chang Hwan, Han, Beom Ku, Kim, Dong Kyu, Lee, Yang Jic
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Dec 20 2005 | KIM, DONG KYU | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017452 | /0838 | |
| Dec 20 2005 | LEE, YANG JIC | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017452 | /0838 | |
| Dec 20 2005 | HAN, BEOM KU | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017452 | /0838 | |
| Dec 20 2005 | HWANG, CHANG HWAN | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017452 | /0838 | |
| Jan 09 2006 | Samsung Electronics Co., Ltd. | (assignment on the face of the patent) | / |
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