Patent
   D647891
Priority
Nov 08 2010
Filed
Jan 14 2011
Issued
Nov 01 2011
Expiry
Nov 01 2025
Assg.orig
Entity
unknown
2
19
n/a
The ornamental design for Bluetooth earset, as shown and described.

FIG. 1 is a perspective view of Bluetooth earset, showing a new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Son, Hyun-Keun

Patent Priority Assignee Title
D664125, Oct 04 2011 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset
D801313, Jul 13 2016 Shenzhen Joway Power Supply Co., Ltd Wireless earset
Patent Priority Assignee Title
7805109, Sep 06 2007 Cal-Comp Electronics and Communications Company Limited Detachable earphone structure
7925037, Oct 19 2005 Sony Corporation Communications headset
8000492, Feb 07 2007 Giga-Byte Technology Earphone set
D538271, Nov 01 2005 Samsung Electronics Co., Ltd. Headset
D539787, Oct 27 2005 Samsung Electronics Co., Ltd. Headset
D568301, Oct 27 2005 Samsung Electronics Co., Ltd. Headset
D582897, Feb 09 2007 Motorola Mobility LLC User interface
D588113, Aug 27 2007 HMD Global Oy Headset
D590377, Sep 13 2007 HMD Global Oy Headset
D603378, Jun 17 2008 Motorola Mobility LLC Headset for a communication device
D608766, Mar 31 2009 HMD Global Oy Headset
D616873, Sep 17 2008 Bluetooth wireless headset
D620927, Jun 08 2009 FIH (Hong Kong) Limited Bluetooth earphone
D626946, Nov 06 2009 Samsung Electronics Co., Ltd. Wireless headset
D629396, Jan 05 2007 Apple Inc. Ear piece
D636381, Jul 07 2010 Microsoft Mobile Oy Headset
D637184, Jun 04 2010 Earloomz LLC Earphone
D640242, Jul 27 2010 BlackBerry Limited Headset
D643420, Sep 22 2010 HMD Global Oy Headset
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 13 2011SON, HYUN-KEUNSAMSUNG ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0257660606 pdf
Jan 14 2011Samsung Electroncs Co., Ltd.(assignment on the face of the patent)
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