Patent
   D582387
Priority
Jan 02 2008
Filed
Jan 02 2008
Issued
Dec 09 2008
Expiry
Dec 09 2022
Assg.orig
Entity
unknown
4
25
n/a
The ornamental design for a headset, shown and described.

FIG. 1 is a front perspective view of the headset;

FIG. 2 is a front elevational view of the headset;

FIG. 3 is a rear elevational view of the headset;

FIG. 4 is a left side elevational view of the headset;

FIG. 5 is a right side elevational view of the headset;

FIG. 6 is a top plan view of the headset;

FIG. 7 is a bottom plan view of the headset; and,

FIG. 8 is a front elevational view of the headset.

The broken lines form no part of the claimed design.

Jung, Hei-Chae

Patent Priority Assignee Title
D632676, Jan 14 2010 JAWB ACQUISITION LLC; JAWB Acquisition, LLC Headset
D633481, Apr 05 2010 Cheng Uei Precision Industry Co., Ltd. Bluetooth headset
D664950, Feb 24 2011 Motorola Mobility LLC Headset for a communication device
D684952, Dec 26 2011 Sony Corporation Earphone
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 02 2008Uneeds Commerce(assignment on the face of the patent)
Jan 02 2008JUNG, HEI-CHAEUneeds CommerceASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0203460667 pdf
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