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I claim the ornamental design for the light emitting diode, as shown and described.
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FIG. 1 is a front perspective view of a light emitting diode showing my new design;
FIG. 2 is a rear perspective view of a light emitting diode according to the embodiment of FIG. 1;
FIG. 3 is a front side view of the light emitting diode according to the embodiment of FIG. 1;
FIG. 4 is a left view of the light emitting diode according to the embodiment of FIG. 1;
FIG. 5 is a plan view of the light emitting diode according to the embodiment of FIG. 1;
FIG. 6 is a right view of the light emitting diode according to the embodiment of FIG. 1;
FIG. 7 is a bottom side of the light emitting diode according to the embodiment of FIG. 1; and,
FIG. 8 is a rear elevational view of the light emitting diode according to the embodiment of FIG. 1.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Patent | Priority | Assignee | Title |
D539760, | Sep 09 2003 | Nichia Corporation | Light emitting diode |
D553103, | Sep 09 2003 | Nichia Corporation | Light emitting diode |
D565752, | Jun 20 2006 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
D565755, | Jun 20 2006 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
D589009, | Sep 09 2003 | Nichia Corporation | Light emitting diode |
D601519, | Sep 09 2003 | Nichia Corporation | Light emitting diode |
D602450, | Sep 07 2007 | CREE LED, INC | LED chip |
D635525, | Apr 22 2009 | CREELED, INC | LED chip |
D691569, | Mar 25 2011 | CREELED, INC | LED chip |
D772181, | Apr 02 2015 | Nichia Corporation | Light emitting diode package substrate |
D790487, | Apr 02 2015 | Nichia Corporation | Light emitting diode package substrate |
D825499, | Sep 29 2016 | Nichia Corporation | Light emitting diode package |
D854195, | Sep 29 2016 | Nichia Corporation | Light emitting diode package |
D886751, | Sep 29 2016 | Nichia Corporation | Light emitting diode module |
Patent | Priority | Assignee | Title |
6355946, | Dec 16 1998 | Lucent Technologies Inc | Semiconductor device with reflector |
6483623, | Nov 28 1997 | Dowa Mining Co., Ltd. | Lamp apparatus for use in optical communication and a process for producing the same |
6624491, | Jun 30 1998 | Osram GmbH | Diode housing |
6717256, | Aug 31 1998 | Rohm Co., Ltd. | Mounting structure for semiconductor device having entirely flat leads |
D432095, | Oct 09 1998 | Vishay Semiconductor GmbH | Light-emitting semi-conductor component |
D437798, | Nov 18 1999 | Sharp Kabushiki Kaisha | Light emitting diode |
D439351, | Nov 18 1999 | Sharp Kabushiki Kaisha | Light emitting diode |
D471166, | Apr 06 2001 | Kabushiki Kaisha Toshiba | Light emitting semiconductor device |
D482337, | Dec 28 2001 | Nichia Corporation | Light emitting diode (LED) |
D490387, | Nov 22 2001 | Nichia Corporation | Light emitting diode |
D491899, | May 22 2002 | Nichia Corporation | Light emitting diode |
D494550, | Aug 26 2003 | Nichia Corporation | Light emitting diode |
D495304, | Nov 10 2003 | SAMSUNG ELECTRONICS CO , LTD | Light-emitting diode |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 04 2004 | SUMITANI, NAOFUMI | Nichia Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016431 | /0762 | |
Mar 30 2005 | Nichia Corporation | (assignment on the face of the patent) | / |
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