Patent
   D635525
Priority
Apr 22 2009
Filed
Apr 22 2009
Issued
Apr 05 2011
Expiry
Apr 05 2025

TERM.DISCL.
Assg.orig
Entity
unknown
25
33
n/a
The ornamental design for a led chip, as shown and described.

FIG. 1 is a top perspective view of an LED chip showing our design;

FIG. 2 is a top view thereof;

FIG. 3 is a first side view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a different side view thereof;

FIG. 6 is an end view thereof;

FIG. 7 is an opposing end view thereof;

FIG. 8 is a top perspective view of the LED chip of FIG. 1 with the top surface removed;

FIG. 9 is a top view thereof;

FIG. 10 is a first side view thereof;

FIG. 11 is a bottom view thereof;

FIG. 12 is a different side view thereof;

FIG. 13 is an end view thereof; and,

FIG. 14 is an opposing end view thereof.

The broken lines define portions of the LED chip that form no part of the claimed design.

Donofrio, Matthew, Edmond, John A., Bergmann, Michael J., Parker, Winston T.

Patent Priority Assignee Title
D645008, Nov 08 2010 SemiLEDS Optoelectronics Co., Ltd. Light emitting diode device
D673125, Feb 24 2011 CREE LED, INC Light emitting diode
D675580, Feb 24 2011 CREE LED, INC Light emitting diode
D676001, Apr 07 2011 EPISTAR CORPORATION Light emitting diode
D680085, Nov 28 2011 EPISTAR CORPORATION Light-emitting diode array
D684548, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D684549, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D684940, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D684941, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D685334, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D687395, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D689834, Oct 28 2011 Semileds Opto Electronics Co., Ltd. LED chip
D690670, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D691569, Mar 25 2011 CREELED, INC LED chip
D693779, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D730303, Jun 10 2014 High Power Opto, Inc. LED chip
D737228, Apr 07 2011 EPISTAR CORPORATION Light emitting diode
D743354, Dec 07 2012 EPISTAR CORPORATION Light-emitting diode
D764422, Dec 07 2012 EPISTAR CORPORATION Light-emitting diode
D794582, Jul 29 2016 ENRAYTEK OPTOELECTRONICS CO., LTD.; ENRAYTEK OPTOELECTRONICS CO , LTD LED chip
D795822, Jul 29 2016 ENRAYTEK OPTOELECTRONICS CO., LTD.; ENRAYTEK OPTOELECTRONICS CO , LTD LED chip
D899384, Nov 04 2019 PUTCO, INC Surface-mount device
D920933, Nov 04 2019 Putco, Inc. Surface-mount device
ER3219,
ER453,
Patent Priority Assignee Title
6097040, Jul 23 1997 Sharp Kabushiki Kaisha Semiconductor light emitting device that prevents current flow in a portion thereof directly under an electrode wire bonding pad
6255129, Sep 07 2000 EPISTAR CORPORATION Light-emitting diode device and method of manufacturing the same
6383835, Sep 01 1995 Canon Kabushiki Kaisha IC package having a conductive material at least partially filling a recess
6498592, Feb 16 1999 MEC MANAGEMENT, LLC Display tile structure using organic light emitting materials
6518598, Dec 21 2001 EPISTAR CORPORATION III-nitride LED having a spiral electrode
6713868, Nov 30 2001 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure
6847052, Jun 17 2002 Kopin Corporation Light-emitting diode device geometry
6870519, Mar 28 2001 Intel Corporation Methods for tiling multiple display elements to form a single display
7289089, Aug 03 2001 Sony Corporation Light emitting unit
20030222263,
20050023539,
20050067624,
20060049422,
20060131600,
20060151800,
20060226437,
20070075323,
20070085089,
20070138585,
D521952, Feb 23 2004 Kabushiki Kaisha Toshiba Semiconductor device
D522466, Sep 09 2003 Nichia Corporation Light emitting diode
D566056, Dec 20 2006 CREE LED, INC LED chip
D566057, Dec 21 2006 CREE LED, INC LED chip
D566665, Apr 18 2007 Edison Opto Corporation Matrix type light emitting diode assembly
D582865, Jun 11 2007 CREE LED, INC LED chip
D582866, Sep 07 2007 CREE LED, INC LED chip
D583338, Sep 07 2007 CREE LED, INC LED chip
D602450, Sep 07 2007 CREE LED, INC LED chip
JP1233259,
JP1294312,
JP1300883,
TW109667,
TW112798,
//////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 22 2009Cree, Inc.(assignment on the face of the patent)
Jun 04 2009EDMOND, JOHN A Cree, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0229820321 pdf
Jul 03 2009BERGMANN, MICHAEL J Cree, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0229820321 pdf
Jul 06 2009DONOFRIO, MATTHEWCree, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0229820321 pdf
Jul 09 2009PARKER, WINSTON T Cree, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0229820321 pdf
Mar 01 2021Cree, IncCREELED, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0557800121 pdf
Feb 07 2022SMART High Reliability Solutions, LLCCITIZENS BANK, N A SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0589830001 pdf
Feb 07 2022SMART EMBEDDED COMPUTING, INC CITIZENS BANK, N A SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0589830001 pdf
Feb 07 2022CREELED, INC CITIZENS BANK, N A SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0589830001 pdf
Feb 07 2022SMART MODULAR TECHNOLOGIES, INC CITIZENS BANK, N A SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0589830001 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule