Patent
   D673125
Priority
Feb 24 2011
Filed
Feb 24 2011
Issued
Dec 25 2012
Expiry
Dec 25 2026
Assg.orig
Entity
unknown
7
11
n/a
The ornamental design for a light emitting diode, as shown and described.

FIG. 1 is a top perspective view of a light emitting diode showing our design;

FIG. 2 is a top view thereof;

FIG. 3 is a side view thereof;

FIG. 4 is bottom view thereof;

FIG. 5 is a side view opposite the side view of FIG. 3;

FIG. 6 is front view thereof;

FIG. 7 is a back view opposite the front view of FIG. 6;

FIG. 8 is a top perspective view of a light emitting diode showing our design;

FIG. 9 is a top view thereof;

FIG. 10 is a side view thereof;

FIG. 11 is bottom view thereof;

FIG. 12 is a side view opposite the side view of FIG. 10;

FIG. 13 is front view thereof;

FIG. 14 is a back view opposite the front view of FIG. 13;

FIG. 15 is a top perspective view of a light emitting diode showing our design;

FIG. 16 is a top view thereof;

FIG. 17 is a side view thereof;

FIG. 18 is bottom view thereof;

FIG. 19 is a side view opposite the side view of FIG. 17;

FIG. 20 is front view thereof;

FIG. 21 is a back view opposite the front view of FIG. 20;

FIG. 22 is a top perspective view of a light emitting diode showing our design;

FIG. 23 is a top view thereof;

FIG. 24 is a side view thereof;

FIG. 25 is bottom view thereof;

FIG. 26 is a side view opposite the side view of FIG. 24;

FIG. 27 is front view thereof; and,

FIG. 28 is a back view opposite the front view of FIG. 27.

The broken lines shown herein are for illustrative purposes only and form no part of the claimed design.

Edmond, John Adam, Donofrio, Matthew

Patent Priority Assignee Title
D684940, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D685334, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D689834, Oct 28 2011 Semileds Opto Electronics Co., Ltd. LED chip
D690670, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D693779, Oct 28 2011 SemiLEDS Optoelectronics Co., Ltd. LED chip
D772181, Apr 02 2015 Nichia Corporation Light emitting diode package substrate
D790487, Apr 02 2015 Nichia Corporation Light emitting diode package substrate
Patent Priority Assignee Title
8138509, Feb 27 2009 VisEra Technologies Company Limited; SEMILEDS OPTOELECTRONICS CO , LTD Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate
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D566057, Dec 21 2006 CREE LED, INC LED chip
D582865, Jun 11 2007 CREE LED, INC LED chip
D582866, Sep 07 2007 CREE LED, INC LED chip
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D635525, Apr 22 2009 CREELED, INC LED chip
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 24 2011Cree, Inc.(assignment on the face of the patent)
Apr 25 2011DONOFRIO, MATTHEWCree, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0262300389 pdf
May 02 2011EDMOND, JOHN ADAMCree, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0262300389 pdf
Mar 01 2021Cree, IncCREE LED, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0560120200 pdf
Feb 07 2022SMART MODULAR TECHNOLOGIES, INC CITIZENS BANK, N A SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0589830001 pdf
Feb 07 2022SMART High Reliability Solutions, LLCCITIZENS BANK, N A SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0589830001 pdf
Feb 07 2022SMART EMBEDDED COMPUTING, INC CITIZENS BANK, N A SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0589830001 pdf
Feb 07 2022CREELED, INC CITIZENS BANK, N A SECURITY INTEREST SEE DOCUMENT FOR DETAILS 0589830001 pdf
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