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Patent
D522976
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Priority
Sep 09 2004
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Filed
Nov 19 2004
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Issued
Jun 13 2006
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Expiry
Jun 13 2020
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Assg.orig
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Entity
unknown
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1
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13
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n/a
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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a top plan view of a semiconductor device, showing my new design; the opposite side being a mirror image thereof;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof; the opposite side being a mirror image thereof;
FIG. 4 is a rear elevational view thereof; and,
FIG. 5 is an enlarged fragmented rear elevational view thereof, taken along the line 5—5 in FIG. 2.
Mizukoshi, Yukiko
Patent |
Priority |
Assignee |
Title |
6268650, |
May 25 1999 |
Round Rock Research, LLC |
Semiconductor device, ball grid array connection system, and method of making |
6515355, |
Sep 02 1998 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Passivation layer for packaged integrated circuits |
6531335, |
Apr 28 2000 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods |
20020064901, |
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20020093082, |
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20030064542, |
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20030165051, |
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D319814, |
Apr 13 1988 |
IBIDEN CO , LTD |
Semi-conductor substrate with conducting pattern |
D457146, |
Nov 29 2000 |
Kabushiki Kaisha Kaisha Toshiba |
Substrate for a semiconductor element |
D473198, |
Oct 26 2001 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
JP1145773, |
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JP1166594, |
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JP1166916, |
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