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The ornamental design for a heat sink, as shown and described.
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This article is used for cooling a heated electronic component such as a CPU which is typically used in a microcomputer and is mounted on the rear of the metallic base.
FIG. 1 is a front side elevation view of the heat sink;
FIG. 2 is a rear side elevation view;
FIG. 3 is a right side elevation view;
FIG. 4 is a left side elevation view;
FIG. 5 is a top plan view;
FIG. 6 is a bottom plan view;
FIG. 7 is a perspective view as viewed from the front;
FIG. 8 is a perspective view as viewed from the rear;
FIG. 9 is a cross sectional view as taken along line 9—9 of FIG. 1; and,
FIG. 10 is a cross sectional view as taken along line 10—10 of FIG. 5.
This article is formed with a plurality of metallic fins which are integrally provided on a metallic base.
Ogawara, Toshiki, Ikeda, Tomoaki, Miyazawa, Masashi
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 03 2005 | MIYAZAWA, MASASHI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016792 | /0421 | |
Oct 03 2005 | IKEDA, TOMOAKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016792 | /0421 | |
Oct 03 2005 | OGAWARA, TOSHIKI | SANYO DENKI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016792 | /0421 | |
Nov 08 2005 | Sanyo Denki Co., Ltd. | (assignment on the face of the patent) | / |
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