Patent
   D529450
Priority
May 12 2005
Filed
Nov 08 2005
Issued
Oct 03 2006
Expiry
Oct 03 2020
Assg.orig
Entity
unknown
5
15
n/a
The ornamental design for a heat sink, as shown and described.

This article is used for cooling a heated electronic component such as a CPU which is typically used in a microcomputer and is mounted on the rear of the metallic base.

FIG. 1 is a front side elevation view of the heat sink;

FIG. 2 is a rear side elevation view;

FIG. 3 is a right side elevation view;

FIG. 4 is a left side elevation view;

FIG. 5 is a top plan view;

FIG. 6 is a bottom plan view;

FIG. 7 is a perspective view as viewed from the front;

FIG. 8 is a perspective view as viewed from the rear;

FIG. 9 is a cross sectional view as taken along line 9—9 of FIG. 1; and,

FIG. 10 is a cross sectional view as taken along line 10—10 of FIG. 5.

This article is formed with a plurality of metallic fins which are integrally provided on a metallic base.

Ogawara, Toshiki, Ikeda, Tomoaki, Miyazawa, Masashi

Patent Priority Assignee Title
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D648479, Apr 18 2011 SIGNIFY HOLDING B V Luminaire
D936622, Jan 17 2019 Telefonaktiebolaget LM Ericsson (publ) Baffle for heat sink
D942959, Jan 29 2020 VEEA INC Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 03 2005MIYAZAWA, MASASHISANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0167920421 pdf
Oct 03 2005IKEDA, TOMOAKISANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0167920421 pdf
Oct 03 2005OGAWARA, TOSHIKISANYO DENKI CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0167920421 pdf
Nov 08 2005Sanyo Denki Co., Ltd.(assignment on the face of the patent)
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