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Patent
D567772
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Priority
Dec 29 2006
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Filed
Apr 23 2007
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Issued
Apr 29 2008
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Expiry
Apr 29 2022
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Assg.orig
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Entity
unknown
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4
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9
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n/a
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The ornamental design for a heat sink, as shown.
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FIG. 1 is a perspective view of a heat sink of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Lin, Yu-Chen, Xu, Hong-Bo
Patent |
Priority |
Assignee |
Title |
6189601, |
May 05 1999 |
Intel Corporation |
Heat sink with a heat pipe for spreading of heat |
6308771, |
Oct 29 1998 |
Advanced Thermal Solutions, Inc. |
High performance fan tail heat exchanger |
6373701, |
Jun 14 2000 |
Foxconn Precision Components Co., Ltd. |
Heat dissipation assembly |
6450248, |
Oct 29 2001 |
Hoya Tech Co., Ltd. |
Heat sink retainer |
20050072555, |
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|
|
20070246189, |
|
|
|
D465462, |
Jul 24 2001 |
|
Base for a heat dissipating assembly |
D529450, |
May 12 2005 |
Sanyo Denki Co., Ltd. |
Heat sink |
D529873, |
May 14 2005 |
Foxconn Technology Co., Ltd. |
Heat sink |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a