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The ornamental design for a computer processor module having a front release mechanism, as shown and described.
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FIG. 1 is an enlarged partial front perspective view of the design for the computer processor module having a front release mechanism in a secured configuration;
FIG. 2 is a front elevational view of the design for the computer processor module having a front release mechanism in a secured configuration as illustrated in FIG. 1;
FIG. 3 is a right side elevational view of the design for the computer processor module having a front release mechanism in a secured configuration as illustrated in FIG. 1, the left side being substantially the same as the illustrated right side;
FIG. 4 is a top elevational view of the design for the computer processor module having a front release mechanism in a secured configuration as illustrated in FIG. 1;
FIG. 5 is a bottom elevational view of the design for the computer processor module having a front release mechanism in a secured configuration as illustrated in FIG. 1;
FIG. 6 is a partial front perspective view of the design for the computer processor module having a front release mechanism as illustrated in FIG. 1, wherein the front release mechanism is illustrated in a partially release configuration;
FIG. 7 is a partial front perspective view of the design for the computer processor module having a front release mechanism as illustrated in FIG. 1, wherein the front release mechanism is illustrated in a fully released configuration;
FIG. 8 is a front elevational view of the design for the computer processor module having a front release mechanism in a fully released configuration as illustrated in FIG. 7;
FIG. 9 is a right side elevational view of the design for the computer processor module having a front release mechanism in a fully released configuration as illustrated in FIG. 7, the left side being substantially the same as the illustrated right side;
FIG. 10 is a top elevational view of the design for the computer processor module having a front release mechanism in a fully released configuration as illustrated in FIG. 7;
FIG. 11 is a bottom elevational view of the design for the computer processor module having a front release mechanism in a fully released configuration as illustrated in FIG. 7;
FIG. 12 is a partial front perspective view of the design for the computer processor module having a front release mechanism as illustrated in FIG. 1, wherein the computer processor module is illustrated in context of a rack mountable computer, e.g., a server, that can be mounted in a rack computer system; and,
FIG. 13 is a front elevational view of the design for the computer processor module having a front release mechanism as illustrated in FIG. 12, wherein the computer processor module is illustrated in context of a rack mountable computer, e.g., a server, that can be mounted in a rack computer system.
In these drawings, the solid lines illustrate the claimed ornamental design, whereas the broken lines illustrate environmental features that form no part of the claimed ornamental design of the subject embodiment.
Nguyen, Minh H., Wang, Qiang, Selvidge, David A.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 22 2005 | WANG, QIANG | Hewlett-Packard Development Company, LP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016865 | /0051 | |
Jul 22 2005 | NGUYEN, MINH H | Hewlett-Packard Development Company, LP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016865 | /0051 | |
Jul 22 2005 | SEVIDGE, DAVID A | Hewlett-Packard Development Company, LP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016865 | /0051 | |
Aug 03 2005 | Hewlett-Packard Development Company, L.P. | (assignment on the face of the patent) | / | |||
Oct 27 2015 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Hewlett Packard Enterprise Development LP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037079 | /0001 |
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