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The ornamental design for a heat dissipator, as shown and described.
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The broken line showing of heat pipes is included for the purpose of illustrating environmental structure and forms no part of the claimed design.
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
7025125, | Feb 04 2004 | Gold Charm Limited | Heat dissipating device with heat pipe |
7130192, | Apr 27 2004 | FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD | Heat dissipating device |
7218518, | Mar 10 2004 | QUANTA COMPUTER INC. | Heat dissipation device with heat pipes |
D481452, | Dec 09 2002 | Heat dissipator | |
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Sep 11 2006 | HUANG, YI-HE | COOLER MASTER CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 018328 | /0740 | |
Sep 29 2006 | Cooler Master Co., Ltd. | (assignment on the face of the patent) | / | |||
Nov 16 2011 | COOLER MASTER CO , LTD | CHEMTRON RESEARCH LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027567 | /0332 | |
Dec 22 2022 | CHEMTRON RESEARCH LLC | INTELLECTUAL VENTURES ASSETS 186 LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 062667 | /0076 | |
Feb 14 2023 | MIND FUSION, LLC | INTELLECTUAL VENTURES ASSETS 191 LLC | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 063295 | /0001 | |
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