|
The ornamental design for a heat dissipator, as shown and described.
|
FIG. 1 is a perspective view of heat dissipator showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Patent | Priority | Assignee | Title |
5335722, | Sep 30 1993 | Global Win Technology Co., Ltd; Huei Bin Enterprise Corp. | Cooling assembly for an integrated circuit |
6377458, | Jul 31 2000 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump |
6525939, | Aug 08 2000 | Wistron Corporation; Acer Incorporated | Heat sink apparatus |
6587341, | Mar 04 2002 | Chun Long Metal Co., Ltd. | Heat dissipater structure |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |