Patent
   D566828
Priority
May 02 2006
Filed
Oct 27 2006
Issued
Apr 15 2008
Expiry
Apr 15 2022
Assg.orig
Entity
unknown
1
6
n/a
The ornamental design for a heat dissipating assembly, as shown and described.

FIG. 1 is a perspective view of a heat dissipating assembly showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof, the left side being a mirror image;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Tzeng, Guo-Shiung, Hsu, Ching-Yu, Hung, Pei-Ching

Patent Priority Assignee Title
D660256, Feb 25 2011 Zalman Tech Co., Ltd. Radiator for an electronic device
Patent Priority Assignee Title
7025125, Feb 04 2004 Gold Charm Limited Heat dissipating device with heat pipe
7130192, Apr 27 2004 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Heat dissipating device
7218518, Mar 10 2004 QUANTA COMPUTER INC. Heat dissipation device with heat pipes
D481452, Dec 09 2002 Heat dissipator
D491260, Jan 16 2003 Heat dissipator
D509580, Dec 24 2003 COOLER MASTER CO , LTD Dual-fan heat dissipator
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 28 2006TEZENG, GUO-SHIUNGAMA PRECISION INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0184730515 pdf
Sep 28 2006HUNG, PEI-CHINGAMA PRECISION INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0184730515 pdf
Oct 02 2006HSU, CHING-YUAMA PRECISION INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0184730515 pdf
Oct 27 2006AMA Precision, Inc.(assignment on the face of the patent)
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