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Patent
D566828
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Priority
May 02 2006
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Filed
Oct 27 2006
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Issued
Apr 15 2008
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Expiry
Apr 15 2022
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Assg.orig
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Entity
unknown
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1
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6
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n/a
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The ornamental design for a heat dissipating assembly, as shown and described.
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FIG. 1 is a perspective view of a heat dissipating assembly showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof, the left side being a mirror image;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
Tzeng, Guo-Shiung, Hsu, Ching-Yu, Hung, Pei-Ching
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