Patent
   D565514
Priority
Jul 05 2006
Filed
Jul 05 2006
Issued
Apr 01 2008
Expiry
Apr 01 2022
Assg.orig
Entity
unknown
18
18
n/a
The ornamental design for package for light emitting diode, as shown and described.

FIG. 1 is a perspective view of a package for light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view, the right elevational view being a mirror image thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken lines represent unclaimed subject matter.

Cho, Jae Ho

Patent Priority Assignee Title
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//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 05 2006Seoul Semiconductor Co. Ltd.(assignment on the face of the patent)
Sep 20 2006CHO, JAE HOSEOUL SEMICONDUCTOR CO LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0183820742 pdf
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