Patent
   D889422
Priority
Apr 13 2018
Filed
Oct 12 2018
Issued
Jul 07 2020
Expiry
Jul 07 2035

TERM.DISCL.
Assg.orig
Entity
unknown
0
27
n/a
The ornamental design for light emitting diode package, as shown and described.

1. Light emitting diode package

1.1 : Perspective

1.2 : Front

1.3 : Back

1.4 : Left

1.5 : Right

1.6 : Top

1.7 : Bottom

Lee, Myunghee, Choi, SeungRi, Bang, SeMin

Patent Priority Assignee Title
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 12 2018Seoul Semiconductor Co., Ltd.(assignment on the face of the patent)
Mar 10 2020CHOI, SEUNGRISEOUL SEMICONDUCTOR CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0520810558 pdf
Mar 10 2020BANG, SEMINSEOUL SEMICONDUCTOR CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0520810558 pdf
Mar 10 2020LEE, MYUNGHEESEOUL SEMICONDUCTOR CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0520810558 pdf
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