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Patent
D573116
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Priority
Oct 19 2006
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Filed
Oct 19 2006
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Issued
Jul 15 2008
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Expiry
Jul 15 2022
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Assg.orig
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Entity
unknown
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6
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17
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n/a
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We claim the ornamental design for a new bridge rectifier package with heat sink, as shown and described.
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FIG. 1 is a perspective view, left top of a first embodiment of a new bridge rectifier package with heat sink;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a left of front view thereof;
FIG. 5 is a right of front view thereof;
FIG. 6 is a front view thereof; and
FIG. 7 is a back view thereof;
FIG. 8 is a perspective view, left top of an second embodiment of a new bridge rectifier package with heat sink;
FIG. 9 is a top view thereof;
FIG. 10 is a bottom view thereof;
FIG. 11 is a left of front view thereof;
FIG. 12 is a right of front view thereof;
FIG. 13 is a front view thereof; and,
FIG. 14 is a back view thereof.
Li, Xian, Chou, Ta-Te, Tian, Yong-Qi, Zhang, Xiong-Jie, Fu, Hai
Patent |
Priority |
Assignee |
Title |
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Infineon Technologies Americas Corp |
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Infineon Technologies Americas Corp |
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20060033122, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a