Patent
   D654881
Priority
Oct 19 2006
Filed
Apr 06 2010
Issued
Feb 28 2012
Expiry
Feb 28 2026
Assg.orig
Entity
unknown
3
21
n/a
The ornamental design for a new bridge rectifier package with heat sink, as shown and described.

FIG. 1 is a left, top perspective view of a new bridge rectifier package with heat sink showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a left view thereof;

FIG. 5 is a right view thereof;

FIG. 6 is a front view thereof; and,

FIG. 7 is a back view thereof.

Li, Xian, Chou, Ta-Te, Tian, Yong-Qi, Zhang, Xiong-Jie, Fu, Hai

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 09 2006CHOU, TA-TEVishay General Semiconductor LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0274860933 pdf
Oct 09 2006ZHANG, XIONG-JIEVishay General Semiconductor LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0274860933 pdf
Oct 09 2006LI, XIANVishay General Semiconductor LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0274860933 pdf
Oct 09 2006TIAN, YONG-QIVishay General Semiconductor LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0274860933 pdf
Oct 11 2006FU, HAIVishay General Semiconductor LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0274860933 pdf
Apr 06 2010Vishay General Semiconductor LLC(assignment on the face of the patent)
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