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Patent
D654881
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Priority
Oct 19 2006
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Filed
Apr 06 2010
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Issued
Feb 28 2012
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Expiry
Feb 28 2026
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Assg.orig
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Entity
unknown
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3
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21
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n/a
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The ornamental design for a new bridge rectifier package with heat sink, as shown and described.
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FIG. 1 is a left, top perspective view of a new bridge rectifier package with heat sink showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a left view thereof;
FIG. 5 is a right view thereof;
FIG. 6 is a front view thereof; and,
FIG. 7 is a back view thereof.
Li, Xian, Chou, Ta-Te, Tian, Yong-Qi, Zhang, Xiong-Jie, Fu, Hai
| Patent |
Priority |
Assignee |
Title |
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May 18 1981 |
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SpaceLabs Medical, Inc. |
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Aug 31 1995 |
Semiconductor Components Industries, LLC |
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Infineon Technologies Americas Corp |
High current capacity semiconductor device housing |
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Sep 22 1999 |
ABB POWER ELECTRONICS INC |
High voltage package for electronic device |
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May 05 1998 |
Infineon Technologies Americas Corp |
High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
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Mar 15 1999 |
Gentex Corporation |
Method of making a semiconductor radiation emitter package |
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Oct 22 2001 |
Semiconductor Components Industries, LLC |
Thin, thermally enhanced flip chip in a leaded molded package |
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Nov 12 2003 |
Infineon Technologies Americas Corp |
Low profile package having multiple die |
| 7586179, |
Oct 09 2007 |
Semiconductor Components Industries, LLC |
Wireless semiconductor package for efficient heat dissipation |
| 20040145037, |
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| 20050145998, |
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| 20060001133, |
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| 20060033122, |
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| 20060255362, |
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| 20070012947, |
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| 20080164590, |
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| D573116, |
Oct 19 2006 |
Vishay General Semiconductor LLC |
Bridge rectifier package with heat sink |
| D616387, |
Oct 19 2006 |
Vishay General Semiconductor LLC |
Bridge rectifier package |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a